Electronics Forum | Mon Sep 20 11:21:48 EDT 2010 | tony1
I have this NiPdAu small QFN packge sizes less than 2x2. I tried to do solderability Dip And Look test and there's always some units no wet on either ground pad and small I/O. Can someone help to explain why is this so difficult to set on this surfac
Electronics Forum | Fri Jan 20 09:58:48 EST 2006 | adlsmt
We are using SAC for reflow because of the lower temp and better wetting and copper disolution is not so much an issue in reflow. There is not much difference in the alloys and they can be mixed with no problems. I assume any supplier of SN100C cou
Electronics Forum | Thu Jul 06 15:55:19 EDT 2006 | Vad
guys pls. comment which is better based on actual experience and not on the selling side of it..thanks a lot..people... one of my supplier said SACX is better but I need proof...living....he claim belo: 1. Better hole fill 2. Higher wetting force 3
Electronics Forum | Thu Dec 29 09:20:30 EST 2005 | Cmiller
We have tested SN100C and SAC305 in our selective solder machine (Ersa Versaflow). We wanted to test both alloys in the selective first because the investment in filling the pots is minimal. In our initial tests the SN100C alloy appears to be the bes
Electronics Forum | Mon Jul 17 09:00:29 EDT 2006 | aj
Hi all, We are running with SACX in our Wave. To be honest it was like a drop in replacemnt and we have seen some boards improve believe it or not. we find that running it at an elevated temp. i.e 280 on our selective pallets improves wetting and
Electronics Forum | Thu Oct 06 09:11:14 EDT 2005 | russ
We use a diffrent colored traveller to identify the pbfree vs. other if you will. During our First article inspections we verify that the correct solder is being used per documentation and that the correct traveller is being used for that build. As
Electronics Forum | Mon Jun 25 20:39:08 EDT 2001 | ianchan
Hi mate, no complete info given from what i see, so just some humble comments, mayhaps you review : 1) PCB pad finishing - Copper+nickle plated? coz if so, nickle is a KILLER to good solder wetting. what we did back here, was to HAL coat the nickle
Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t
Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro
Electronics Forum | Sun Aug 08 20:59:55 EDT 1999 | Dreamsniper
| | | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usua
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