Electronics Forum: nist (Page 1 of 2)

Sample preparation

Electronics Forum | Wed Apr 13 17:19:44 EDT 2016 | davef

Formation and Growth of Intermetallics at the Interface Between Lead-free Solders and Copper Substrates [ http://www.boulder.nist.gov/div853/Publication%20files/NIST_Apex94_Siewert.pdf ]

Resistance value level of lead-free solder joint

Electronics Forum | Thu May 29 09:10:10 EDT 2003 | caldon

Dave- Thanks for the NIST Site.....Again, another useful nugget!!! Cal

How to fix flex bent after reflow

Electronics Forum | Mon Oct 31 20:31:06 EDT 2022 | stephendo

Are you calibrated to NIST traceable standards?

Certified glass plates with components

Electronics Forum | Tue Jan 11 11:17:43 EST 2000 | Andy Yates

I wonder whether anyone can tell me where I might purchase a NIST certified glass plate with components placed upon it? Thanks, Andy

Coolingproblem in reflow profile

Electronics Forum | Tue Jun 21 07:39:23 EDT 2005 | davef

There's a fair amount of material on cooling rates for lead free on the web. Look here: * http://www.speedlinetech.com/docs/Cooling-Slopes-Lead-Free-Reflow.pdf * http://www.findarticles.com/p/articles/mi_qa3776/is_200412/ai_n9473486 * http://www.m

Convertion

Electronics Forum | Thu Jul 28 21:54:25 EDT 2005 | Ken

1 us gallon = 231 in^3 (NIST) 1 inch = 2.54 cm 1 in^3 = 16.38cm^3 16.38 cm^3 X 231 = 3785.41 cm^3 1cm^3 = 1g (pure water) 3785.41 cm^3 = 3785.41g or 3.785.41Kg Do I get credit for showing my work?

SMD solder joint calculation

Electronics Forum | Wed Jan 16 20:06:09 EST 2002 | davef

No, not as such. Consider: * Using the IPC calculator [free at http://www.ipc.org]. It allows you to consider / assess the amount of solder when designing pads. * Reviewing IPC-7525 - Stencil Design Guidelines. It gives general aperture guidelines.

International certification programme for lead-free product test

Electronics Forum | Tue Feb 03 09:36:05 EST 2004 | davef

Unfortunately, IPC-D-279, IPC-TM-650, IPC-TR-464, and MIL-STD-810 will not answer your questions, because they do NOT address LF-solders. Even the tests in IPC-9701 need to be modified for LF-solders, because: * LF-solder has different creep behavior

Internal Oven Calibration

Electronics Forum | Sat Feb 11 18:33:36 EST 2006 | KEN

One factor everyone overlooks is that furnace and external T/C wires are (generally) not calibrated. Unless you are sending your wires to a lab for NIST characterization your T/C wires are NOT calibrated. They (new wires)operate within a specifie

Reflow oven profiling - frequency ???

Electronics Forum | Thu Apr 26 08:34:32 EDT 2007 | ck_the_flip

Pavel is right...Your Quality Group, customers, and Management will really appreciate Cpk's. We do Cpk's annually, or whenever a major mechanical change (motor, blower, etc) is made. Pavel is correct in saying that Cpk's on most modern convection o

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