Electronics Forum | Tue Mar 15 16:51:59 EST 2005 | Praveen
Hello: I am looking for papers/information on correlation between lead protrusion and reliability studies conducted on Through-Hole Technologies. I would really appreciate it if information on the same could be made available. Thanks and have a nic
Electronics Forum | Wed Mar 16 18:39:55 EST 2005 | KT
I am looking for the same. IPC 610D does mention about the solder fill based on the class (A,B,C). But, there is no exhaustive study that I have come across. Please let me know if you find any. KT
Electronics Forum | Mon Nov 29 10:13:02 EST 2010 | vetteboy86
My research starts here. I'm just beginning to research the effects of using a leaded part in a no lead process. Before I began, I know there are temperature differences. The part in question has a 260 C spec. Next I would like to find out if any c
Electronics Forum | Tue Feb 24 15:32:10 EST 2015 | swiese242
Hi there. I have an IP3 machine that refuses to > power up the MFU cart on side 1. I have already > replaced the I/O card but still no dice. Is > there a relay or fuse that I need to check to get > this to power up? The machine will not operate
Electronics Forum | Mon Jul 26 19:32:03 EDT 1999 | Steve Gregory
| Can anyone give me the virtues of SMT package castellations vs. no castellations with particular reference to the ruggedness and reliability of the solder joints? Any references or studies that you can point me to? Also, although I'm in favor of
Electronics Forum | Fri May 17 10:08:47 EDT 2013 | shrikant_borkar
HI, We are facing problem of Dry solder due to QFN Grounding Solder not Drain out in Via hole. also No drain hole on PCBs now we have 15k stock. which is leading to massive Rework. We have Tried by minimizing Ground Square apertures. but no Improvem
Electronics Forum | Thu Jul 17 11:36:41 EDT 2003 | caldon
My AOI wish list would include features that: 1)Character recognition, 2) Correct Placement (including missing), 3) Solder joint inspection (solder present), 4) Shorts, 5)Polarity check, 6)Coplanarity, 7)gerber/or Cad compatible (no gold boards), 8)e
Electronics Forum | Tue Jun 08 12:49:41 EDT 1999 | Dave F
| Hi,my master | How to iron out such soldering bridge with below conditions: | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | 3.using spraying fluxer and n
Electronics Forum | Tue Jun 08 13:06:53 EDT 1999 | Kevin Hussey
| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl
