Electronics Forum | Fri Mar 31 17:13:04 EDT 2017 | dontfeedphils
Clean everything to do with the print process during the switch adequately and you shouldn't have an issue.
Electronics Forum | Fri Mar 31 18:10:21 EDT 2017 | jutikagokarn
Thanks Phil! I appreciate the response!
Electronics Forum | Tue May 23 22:23:20 EDT 2000 | JAK
Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e
Electronics Forum | Tue May 23 22:21:13 EDT 2000 | JAK
Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e
Electronics Forum | Fri Mar 31 11:56:36 EDT 2017 | jutikagokarn
We are trying to build two different PCBs - one with no wash flux solder paste and the other with a washable flux solder paste. How difficult is it to use the same SMT line and switch between the two pastes? I assume there will be some cleaning invol
Electronics Forum | Fri Mar 31 13:59:21 EDT 2017 | westshoredesign
Need more information. BUT if your strictly considering just the paste change. I would imagine your changeover would be little to no different than changing to the second board if you were using the same paste. Maybe take extra care cleaning your sq
Electronics Forum | Fri Mar 31 15:58:07 EDT 2017 | jutikagokarn
Thank you for your response. We build boards on an SMT line that is shared with other companies too and are currently using water soluble flux based solder paste on both boards. We realized an issue with washing on one of the boards so requested to
Electronics Forum | Fri Apr 07 09:03:07 EDT 2017 | pavel_murtishev
jng123, Process-wise using one solder paste type is preferred regardless of paste type. If you want clean both paste types in one cleaning machine your manufacturer might have, this potentially could lead to white residue issue due to chemical reac
Electronics Forum | Mon Jul 16 14:48:16 EDT 2001 | mparker
Just received "Circuits Assembly", July 2001 issue. An article regarding solder balls and aperture design, beginning on page 40. This DOE had aperture, reflow profile and no clean pastes (3 types) as attributes. It is advocated that a U-shaped a
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
