Electronics Forum | Thu Apr 01 09:10:55 EST 2004 | cyclopsn
We are currently using non clean paste and non clean flux in our manufacturing process. But recently our customer feedback that using a non clean process might cause flux blockage in via hole area and potentially might burn or explode the boards over
Electronics Forum | Sun Apr 04 10:20:26 EDT 2004 | cyclopsn
Hi Ken I'm not so sure about the voltage level but I'm dealing with backplane boards. Michael, Thanks for the information, I dont mind changing the process but I need to understand why I needed to do do. That is only my concern.
Electronics Forum | Thu Apr 01 22:06:58 EST 2004 | Ken
How high a voltage? TV products use hundreds of volts on the vertical and horizonatal sync circuits. Historically, these consumer products were NOT cleaned. For your situation, contact your paste supplier.
Electronics Forum | Fri Apr 02 00:16:18 EST 2004 | Mike Konrad
There is no shortage of reasons to clean your boards. Soldering or reflowing your boards leaves �stuff� on them. This �stuff� is normally corrosive and conductive (some fluxes / pastes are more corrosive / conductive than others). In either case,
Electronics Forum | Tue Sep 14 14:22:11 EDT 2010 | grahamcooper22
If the HASL was poor quality and very thin you would find this defect....but you would expect to see it on more pads also. Also, you'd expect to see your solder from your solder paste either dewetted on the pad or reflowed onto the BGA sphere making
Electronics Forum | Wed Sep 15 01:16:36 EDT 2010 | dan_ems
Hello, what type of solder paste use, and this component is made for lead process?
Electronics Forum | Wed Sep 15 03:04:13 EDT 2010 | genesan
kester 562 clean process and this leaded part.
Electronics Forum | Fri Sep 17 07:33:56 EDT 2010 | scottp
Based on the last few pictures in the report, the root cause is lousy HASL. In fact, you don't have HASL - you've got SnCu intermetallic. Don't mess with your reflow profile, change paste, or monkey with anything else in your process. Have the boar
Electronics Forum | Fri Jul 07 09:15:23 EDT 2000 | K. Chak
Hi Dave, This particular p/n calls for print&etch for wet process..and the problem occured due to surface contamin. with resist residue resisting copper from etching off. The high pressure nozzle was a problem at developing oper. and it is fixed now
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
