Electronics Forum: non-wetting gold (Page 1 of 3)

non-wetting on gold land pad

Electronics Forum | Wed Oct 27 19:50:59 EDT 1999 | chris

Hi What is the possible cause of non-wetting of solder paste to the gold land pad. What we observed in the surface of the non-wet pad is an organic FM, and using FTIR we found out that it is a flux. It is possible that the cause of non-wetting is

Re: non-wetting on gold land pad

Electronics Forum | Thu Nov 04 21:36:36 EST 1999 | chris

Hi John, Thanks to your reply, just one question is it possible that the solder paste ( flux material )applied to the pads cause the non-wet. regards Chris

Re: non-wetting on gold land pad

Electronics Forum | Fri Nov 05 10:01:04 EST 1999 | Dave F

Chris: You can have more than "one question!!!" Anyhow, yes crappy solder paste can cause non-wetting, but before you go there understand why the paste is wetting some surfaces, but not others. Ta Dave F

Re: non-wetting on gold land pad

Electronics Forum | Thu Oct 28 09:25:35 EDT 1999 | Dave F

Chris: Typical non-wetting causes are: * Poorly controlled soldering process * Incorrect material * Surface contamination * Insufficient preheat * Misapplied solder mask * Shadowing Without intending to insult you, all of the causes of non-w

Re: non-wetting on gold land pad

Electronics Forum | Thu Oct 28 20:45:38 EDT 1999 | chris

Hi Dave, We suspect that the organic FM causes the non-wetting problem. FTIR analysis confirm that the FM is a flux residue. Dave we only used FTIR to detect organic contaminants, we also used SEM/EDX to determined the elemental composition of the

Re: non-wetting on gold land pad

Electronics Forum | Fri Oct 29 09:36:42 EDT 1999 | Dave F

Chris: Thanks. SMTnet has a "Library." Buried deep within it is a listing of terms. The following is from that listing: Shadowing. When a component blocks the heat or solder wave flow from certain areas of the printed circuit board, resulting in

Re: non-wetting on gold land pad

Electronics Forum | Fri Oct 29 10:02:28 EDT 1999 | John Thorup

Chris A lot of people have reported sudden, fab lot related problems with Ni/Au pads. These are usually characterized by a discoloration of the gold and called cheerful names like "black pad disease". This can be a process problem at your fab house

problem in solderability

Electronics Forum | Wed Sep 10 04:23:42 EDT 2008 | gregoryyork

Wheres the Gold layer on the non wetted part of the pad

Re: Gold plated components - solderability issue

Electronics Forum | Mon Mar 30 07:41:06 EST 1998 | Earl Moon

| Hi, | We have encountered de-wetting issues with gold plated components( SMT LEDs ). | The problem comes and go and we yet to locate the root cause ( process, component or solder paste etc ). | The rest of the components on the boards are not havi

Re: Solder Wetting

Electronics Forum | Tue Dec 14 17:02:04 EST 1999 | John Thorup

Hello Kris If you do have and OSP coating I'd say Curtis has nailed it. But you seem to have references to gold. Does this board have a standard nickle/gold finish. If so what sort of "solder on gold" problems were you having? Reading between the

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