Electronics Forum: non-wetting on qfn (Page 1 of 11)

Solderability Problem on NiPdAu

Electronics Forum | Sun Sep 12 12:45:56 EDT 2010 | tony1

Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks

non-wetting on gold land pad

Electronics Forum | Wed Oct 27 19:50:59 EDT 1999 | chris

Hi What is the possible cause of non-wetting of solder paste to the gold land pad. What we observed in the surface of the non-wet pad is an organic FM, and using FTIR we found out that it is a flux. It is possible that the cause of non-wetting is

Non-wetting on QFP lead

Electronics Forum | Sun Nov 25 20:47:44 EST 2001 | Yngwie

knock!!!knock!!!Hellooo!!!!!!!

Non-wetting on QFP lead

Electronics Forum | Mon Nov 26 21:03:29 EST 2001 | davef

Hehwoo, bin eatin' turkey up at mums house.

Non-wettig on chip cap.

Electronics Forum | Mon Dec 10 04:15:01 EST 2001 | Beny

Thanks for your advise Now I don't found Non-wetting defect at TIN COATED 0603 after I had increased peak temp and Time above 183 C. At film caps, I still found Non-wetting in high rate at film chip size 2416. I using PANASONIC's part with identif

Non-wetting on QFP lead

Electronics Forum | Mon Nov 26 20:15:50 EST 2001 | davef

Sounds like you are thinking correctly. I'd guess your fab has gotten "smart" and changed your bare board, as you suggest. So, you've got two choices: 1 Rework the QFP. 2 Remove the lower temperature PTH components and solder them to the board some

Black Tar on ENIG

Electronics Forum | Mon Oct 20 21:26:57 EDT 2014 | richardciccarone

I have seen a couple of references to Black Tar, Not Black Pad. Apparently, it occurs only on the solder side of PTH's after wave solder and primarily on the edges of the land. It is characterized by a black coloration (Not Ni corrosion?) and non-wet

Non-wettig on chip cap.

Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny

Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta

Re: non-wetting on gold land pad

Electronics Forum | Thu Oct 28 09:25:35 EDT 1999 | Dave F

Chris: Typical non-wetting causes are: * Poorly controlled soldering process * Incorrect material * Surface contamination * Insufficient preheat * Misapplied solder mask * Shadowing Without intending to insult you, all of the causes of non-w

Non-wettig on chip cap.

Electronics Forum | Mon Dec 10 16:44:51 EST 2001 | davef

Good for you!!! Similar to Steve's comments ... 1. NON-WETTING DEFECT: Yes. Your Lonco is a �stand and deliver� flux. Not some limp wrested impersonation of a flux like most nc fluxes. Without speculating about �incompatability�, recognize that

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