Electronics Forum | Fri Jan 07 07:45:44 EST 2011 | davef
Consider measuring the temperature of the BGA solder balls during reflow. This will give you a more accurate impression of the actual soldering temperature than you are getting now. The 1/6/2011 SMT Express Newsletter contained an interesting arti
Electronics Forum | Wed Apr 16 13:19:13 EDT 2003 | Takfire
Thanks Russ! The origianal complaint from the customer was in regards to what appeared as "bumpy" appearance and "holes" in the solder fillet. This problem was originally presented as an appearance issue only. Further investigation by our DPA lab r
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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