Electronics Forum | Tue Jul 17 10:25:59 EDT 2007 | hussman
You want to know which flux will over come thermal mass problems? That's easy - none.
Electronics Forum | Tue May 23 09:16:57 EDT 2006 | Steve
Had exactly the same type of issues. Tried everything from pre fluxing the pcb's , various ammendements to the oven profile and various pastes. Finally after a lot of help from multicore we settled on a paste by the code of cr39. A no clean flux wit
Electronics Forum | Tue May 13 20:48:10 EDT 2008 | davef
Rob On your thermal recipe: Above liquidous for nearly 2 minutes seems to be a scoush long. Not sure you're doing anything positive with things like that. On the article: * SMT Magazine, October, 2002, p24 'Q & A: BGA Dewetting' * "Q: Our manufactu
Electronics Forum | Thu Nov 04 07:53:45 EST 1999 | Chad Notebaert
Sounds like you have a component problem! I say this because you say the sodler is flowing away from the components (leads I assume) This sounds like none wetting of the component. Do a solderability test on the parts. Take the parts and dip the lead
Electronics Forum | Thu Mar 01 17:56:18 EST 2007 | darby
Tested recently on ENIG finish. profile as follows 100-150, 57 sec. 150 210, 46 sec. 210 + , 63 sec. Peak 231. This profile was developed for this paste as per Asahi literature. Operator said it "looked wet and smelled good"! Print quality was excel
Electronics Forum | Mon May 14 17:14:07 EDT 2001 | davef
First, consider checking the fine SMTnet Archives. Look for threads on "white tin", in addition to "immersion tin". We�ve had a cuppla good ones of late. Merix [http://www.merix.com] gives a good comparison of different solderability preservatives
Electronics Forum | Sat Aug 29 08:43:35 EDT 1998 | Dave F
| Hi, Friends, | Could you please recommend me some solder mask materials and equitements for high quality solder mask? Details such as company name, phone numer et al are welcomed. Thanks! | Have a good day | Xingsheng Xingsheng: Consider the follo
Electronics Forum | Tue Feb 01 12:52:19 EST 2005 | jbrower
Hi Tom, I did talk to Bob Gilbert about the sn100c. His comment is that it is a nickle stabalized alloy. Simplisticly, the tin and copper molecules would rather bond with the nickle. He also mentioned that with the SAC alloys, the manufactuers were
Electronics Forum | Wed Aug 11 07:20:33 EDT 2004 | gregoryyork
HASL Fluids are generally not RA based fluxes. They are generally fluxes based on hydrochloric acid or hydrobromic acid or a mixture of the two, plus some very strong wetting agents that are very hygroscopic. Doesn't the residue of hydrochloric go wh
Electronics Forum | Mon Dec 18 16:13:15 EST 2006 | darby
AJ, No overprint. We have components in very close proximity that precluded that. Also we have differing areas of thermal relief for the pads from a large backplane, from none at all to open blocks to individual pad relief. After a few more experimen
