Electronics Forum | Sat Aug 29 09:12:39 EDT 1998 | Dave F
| Hi folks, | Lately I am also having problem with BGA ball problem. | We are finding more and more on X-ray analysis and is very expensive to replace. I know for sure that we could | rework on CCGA but there is no certified process in industry as w
Electronics Forum | Thu Aug 27 20:06:25 EDT 1998 | Kallol Chakraborty
Hi folks, Lately I am also having problem with BGA ball problem. We are finding more and more on X-ray analysis and is very expensive to replace. I know for sure that we could rework on CCGA but there is no certified process in industry as we speak
Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon
| On 1.27mm (0.050 inches) Standard Ball Grid Array's. | The ball size diameter starts at approximately 0.025 inches. | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? | | This
Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff
| | On 1.27mm (0.050 inches) Standard Ball Grid Array's. | | The ball size diameter starts at approximately 0.025 inches. | | | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? |
Electronics Forum | Mon May 25 08:37:28 EDT 2009 | d0min0
Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm on the crossecrion we found that one of the ball seem
Electronics Forum | Wed Sep 02 08:44:50 EDT 1998 | Kelly Morris
| Hi, | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it.
Electronics Forum | Wed Apr 27 01:20:22 EDT 2005 | Frank
Are you sure about your dimensions? .45mil ball diameter and .8mil pitch, and a body size of 16x8mils is really, really tiny. I assume you mean millimeters and not mils? 1mil = 0.0254millimeters If your stencil is 5mils and your ball diameter is
Electronics Forum | Wed Nov 11 10:08:38 EST 1998 | Magnus
| | Hi, | | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent
Electronics Forum | Wed Oct 20 13:53:22 EDT 2004 | Greg D
Hi, What's the maximum and minimum solder void that can be accepted during X-ray? What about the percentage of Ball Roundness..20%? 30%? thanks and regards,
Electronics Forum | Sun Apr 16 14:37:25 EDT 2000 | Roberto Navarro
Hi, I work for Nortel and here rework BGA'S we use DRS22 rework station and CRT 2000 X-ray inspection. The main problem is put again the BGA on the PCB because you need reboling the PCB and you could damage the soldermask. Talking about Air-vac is ve
