Electronics Forum | Mon Jun 29 13:38:20 EDT 1998 | Russ Miculich
| looking for help with fine-pitch printing for what would be the best settings for printing speed, squeegee pressure, seperation speed. | thanks for you time Brian: As Justin says - the issues are many. However, a good start would be to run at 0.75
Electronics Forum | Mon Jul 29 13:34:28 EDT 2013 | dontfeedphils
Usually the reason it will fail a part like that when you are using mechanical centering is because the part is usually picked so off center because of the body shape. So when the centering jaws close to push the part to center they give up and fail
Electronics Forum | Fri Jul 26 11:20:33 EDT 2013 | gnus
Hi all, I'm having issues placing 7 pin DPak packages. I'm using mechanical centering with four centering phases (one for each orientation). Tool used is A24S. Machine picks up the part but will reject it when centering the part. I have measured all
Electronics Forum | Fri Jul 26 12:41:43 EDT 2013 | dontfeedphils
Check the centering force, and change it to High, if it isn't already.
Electronics Forum | Thu Aug 28 08:43:56 EDT 2008 | rgduval
You wouldn't think that placement would affect dewetting or solderability....I wouldn't have either, until it was the only thing left in our process, and when we changed it, things got better. I couldn't begin to explain why, either. The only concl
Electronics Forum | Mon Jul 29 09:43:31 EDT 2013 | cyber_wolf
First figure out which centering phase it is using when the part gets rejected. Then run the machine in step mode and watch whats going on.
Electronics Forum | Mon Jul 29 13:48:20 EDT 2013 | cyber_wolf
We have placed millions of DPAKS on our Mydatas without issues. Usually the crosshairs need to be just slightly to the right of the dimple when trimming. We do not use high centering force. Please tell us exactly what the error message is.
Electronics Forum | Wed Aug 27 14:38:20 EDT 2008 | rgduval
Does your paste provider recommend a TAL? For the leaded and lead-free pastes that we use, the manufacturer recommends 60 seconds above liquidous. I note that your profile shows the TAL as 30 seconds, which may not be sufficient. That said, tho
Electronics Forum | Tue Jan 13 19:41:43 EST 2004 | Tom B
Chris, 1. You may want to check lead finish (plating). 2. Is there shadowing? 3. Is Pik-n-Place providing enough pressure to slighlty push part into paste? 4. Is this a new product? or existing? If existing has suppliers for parts changed? 5. Is
Electronics Forum | Thu Aug 28 11:13:53 EDT 2008 | janz
Have you tried to run the same process but with diffrent solder paste manufacturer.? This give you information whether paste is ok. Try also print paste on the bare board and run through reflow oven. Check 2-3 boards. Is it the same places where i
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