Electronics Forum | Tue May 08 21:13:04 EDT 2001 | Paul
My company is a low-volume high mix contact electronic manufacturer. We are currently looking at purchasing a pick and place machine that is capable of mounting such new components as microBGA's and other CSP's at such ball pitches as 0.5mm for examp
Electronics Forum | Mon Jul 15 17:35:42 EDT 2002 | davef
Micro BGA � (�BGA�). A Tessera brand name for a fine [0.5 mm and 0.75 mm solder ball] pitch BGA.
Electronics Forum | Sat Nov 03 11:20:35 EDT 2012 | davef
EricR: There's substantial information about the properties of solder alloys on the web. Here's an example of something that I clipped from one site Alloy ||Solidus (°C)||Liquidus (C°) ||Tensile Strength (psi / MPa) Sn42 Bi58||-E-||138||8000 / 55.2
Electronics Forum | Wed Nov 07 21:36:17 EST 2012 | davef
Multiple process and rework thermal cycles are brutal on boards and components. Improving reliability of products through reducing thermal stress ends-up being a major driver to the interest in lower MP LF solders. Binary LF solders require the addit
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Wed Dec 08 04:19:16 EST 1999 | pascal MATHIEU
I am working in electronic automotive industry and today we are facing to a very serious problem : if we want to use a PCBoard with a copper thickness of 90�m + fine pitch circuit (0.65mm, 0.5mm) the supplier(several) of the PCB has some trouble t
Electronics Forum | Tue Aug 22 03:04:07 EDT 2006 | PP
Any help/suggestion is much appreciated I am doing lots of BGA Reworks from a small uBGA with a few balls to a large BGA with over 1500 balls. The reworks have been done on SRT 1100 Series Machine for many years. SRT 1100 Machine is good for the c
Electronics Forum | Tue Mar 28 07:28:25 EST 2006 | Rob C
I would have to disagree on this. My experience is that you should never justify capital expediture based on just the obvious up front costs alone. There is no mention of risk of recall, warranty costs, scrap costs,and so on. Which you may get from a
Electronics Forum | Fri May 23 18:55:20 EDT 2008 | gregoryyork
This is one of the biggest mistakes with the Lead Free process. We have all listened to the 'industry experts' and followed their advice and unfortunately got it wrong. Keep the dwell times (dependant on alloy selection) the same as Leaded so you are
