Electronics Forum | Wed Jul 30 11:36:31 EDT 2014 | emeto
About the pads shape - you can do rectangular or oblong. For stencil design oblong is better for small pads(0.2mm) because it will give better release, so having this thought in mind you should probably design oblong shape and then print make paste a
Electronics Forum | Fri Aug 06 03:51:06 EDT 1999 | Thomas
Could someone give recommendation on the stencil opening for printing epoxy on HAL FR4 PCB for 0805 and 0603 size chips capacitors and resisitors. My regular stencil manufacturer recommend the following: Thickness: 8 mils 0805 opening: Oblong 0.35 X
Electronics Forum | Tue Sep 26 03:48:25 EDT 2006 | aj
Have you tried an alternative paste supplier. I have ran quite a few cards now with the homeplate design that I have used for the last few years and we are not experiencing any problems. We experienced MCSB on one product but this card has oblong p
Electronics Forum | Wed Apr 28 12:10:14 EDT 2004 | paul_bmc
Are your solder balls after reflow a perfect sphere or are they oblong, like chushed. I know a heavy bga or incorrect reflow profile could cause bridging. Also too much flux paste. Sometimes what we do is brush the flux paste onto the pcb pads inst
Electronics Forum | Thu May 29 14:35:37 EDT 2008 | rdmundo
Gents, We've been using a round 1:1 aperture for a 5 mils thickness on our stencil design on 0402 and recently, IPC guidelines recommend oblong, homeplate or reverse homeplate. I believed the PCB pad for 0402's area within the recommended size/dimen
Electronics Forum | Tue Sep 01 02:57:42 EDT 2009 | d0min0
davef As for the repair : - with hot air blower it is not possible (you can melt, but it will not wet) - with standard iron - no problem to repair (no additional material is needed) isd.jwendell yes, the profile is checked on those places (same si
Electronics Forum | Wed Jul 03 07:40:48 EDT 2002 | Yannick
Hi, WE are making some test with this kind of component and aperture and here what we think. when you use a home plate aperture it's seem that the component is not lenght enought to have a good solder but maybe is our CAD guy that didn't make a
Electronics Forum | Mon Sep 21 22:25:05 EDT 2009 | davef
What babies!!!! Sure, give it a try. * Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print height equals 1/3 thickness] * For 0603, a
Electronics Forum | Fri Oct 09 06:32:38 EDT 2009 | davef
Here's what is on that post referred to, not sure what you need more than ... "* Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print
Electronics Forum | Tue Nov 03 11:46:52 EST 2009 | davef
Search the finee SMTnet Archives for previous posts on the topic. Here's a clip from on of those posts that may get you started. [snip] * Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, availa
