Electronics Forum: odb package other (Page 1 of 70)

Tantalum influence on other components

Electronics Forum | Wed Jan 17 05:05:30 EST 2007 | Phil J

The most likely cause is moisture vapor outgassing violently from the Tant package. They are known to be moisture sensitive. Try baking some at 120C overnight and reflowing those.

SMT package types

Electronics Forum | Wed Oct 30 09:37:48 EST 2002 | stepheno

One thing to take note of with the TSOP's is that is a T1 variety and a T2 variety. One has the leads on the sides, the other has leads on the ends. I believe the T1 has the leads on the ends, but I would have to look it up to be sure.

Mydata My12 package creation

Electronics Forum | Mon Oct 25 14:15:50 EDT 2010 | duwelt

Hello, we just purchased a My12 machine. We now have to create every single package ourself - a very time consuming work. We asked our Mydata vendor if it is not possible to buy a package library to save time. He said, it is not possible - every comp

Components placement with different package

Electronics Forum | Tue Jul 13 11:21:28 EDT 2021 | stephendo

You may have to use an adaptor board. A small board with one footprint on one side and the other on the other side. Do not assume that the pin outs of the two parts are the same. I have seen smaller parts with a different pin out than the bigger part

Latent shorts on QFN package

Electronics Forum | Wed Mar 04 11:47:42 EST 2009 | patrickbruneel

I have to correct something from my previous post (before someone else corrects me). You can grow dendrites from any conductive surface (Cu, Ni etc.) but the final stage would be lower SIR. In my experience other metals except for tin do not lead to

Re: Wavesoldering of PLCC44 package

Electronics Forum | Fri Feb 25 11:13:32 EST 2000 | Russ

This probably won't help much but I find it at least a little interesting. During some experimentation recently I accidently loaded a board into the wave upside down and it had a PLCC 68 package along with other types of components that had only bee

Re: Wavesoldering of PLCC44 package

Electronics Forum | Fri Feb 25 11:13:32 EST 2000 | Russ

This probably won't help much but I find it at least a little interesting. During some experimentation recently I accidently loaded a board into the wave upside down and it had a PLCC 68 package along with other types of components that had only bee

Re: Wavesoldering of PLCC44 package

Electronics Forum | Fri Feb 25 16:06:51 EST 2000 | Dave F

Istv�n: Given a choice, I�d run second side PLCC44s at 90� to the wave. As far as thieves are concerned, I�d have two, mirror images of each other. Unlike most, these thieves are not connected to pads. They are out-side of the last pad on the sid

Re: Wavesoldering of PLCC44 package

Electronics Forum | Fri Feb 25 16:06:51 EST 2000 | Dave F

Istv�n: Given a choice, I�d run second side PLCC44s at 90� to the wave. As far as thieves are concerned, I�d have two, mirror images of each other. Unlike most, these thieves are not connected to pads. They are out-side of the last pad on the sid

Printing SEMTECH SLP2710P8 8-pin package

Electronics Forum | Fri Aug 07 07:55:30 EDT 2009 | robhs

Hi. We are planning a production run of a board that utilises the SEMTECH SLP2710P8 8-pin device (2.7 x 1.0 x 0.58mm). The part orientation on the board necessitates that the squeegee print direction approaches the stencil apertures on the long side

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