Electronics Forum | Fri Aug 03 15:20:18 EDT 2001 | stmerkt
The press release attached below provides some insight into the direction Tyco is planning to head with the Automation Group. For Immediate Release Tyco Electronics Expands Automation Group; Offers Quad Systems Assembly Equipment Quad Systems
Electronics Forum | Thu Aug 24 15:30:33 EDT 2000 | Steve Thomas
On your last point, Wolfgang, I agree big time. Not that I disagee with the rest, but it's pretty much all been said. The layout of the forum is showy, which is OK by me as long as they've got the hardware to support it. Unfortunately they don't, a
Electronics Forum | Sun Jan 10 08:44:32 EST 1999 | Dave F
| | | HI! I am a package engineer in Korea. I have some reasons | | | to desolder excessive solder at the lead of TSOP and TSOJ | | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. |
Electronics Forum | Mon Jul 20 07:25:47 EDT 1998 | Scott Davies
This really should not constitute verbal abuse; it is simply what has happened. Alphametals lied to me. They said hey, we're going to give you a great deal on all those frames you're not using for the MPM printer, just send them on in. Well, UPS cha
Electronics Forum | Thu Feb 18 14:42:38 EST 2010 | djsmith1000
Hi everyone, First post here. I am completely new to smt as well. We are a small startup and would like improve our in-house smt assembly capability from manual assembly. We are looking at small production runs, initially about a total of 200 board
Electronics Forum | Thu Aug 24 09:23:29 EDT 2000 | Dr. Ning-Cheng Lee
You are asking a very good question which has been an issue in the industry for a long long time. For operating at 225C, you will need a solder with melting point no lower than 270 or even 280C. HMP solder is very difficult to come by. At this stage,
Electronics Forum | Sun Nov 07 10:54:21 EST 1999 | Steve Thomas
We're looking at redesigning our stencils to facilitate better (well, it's pretty much non-existant, so any improvement is a big leap) release from fine pitch apertures. Currently we have perpendicular walled laser cut apertures. We'll be having
Electronics Forum | Tue Dec 16 14:48:03 EST 1997 | Justin Medernach
| Q1. | As part of a Final Year Thesis I am currently undergoing an in-deph study of the Screenprinting process for MPM 3000 Screenprinters. | Ultimately I will be setting up control charts on line. | Does anybody have suggestions in this area ?, I h
Electronics Forum | Thu Mar 23 12:11:20 EST 2006 | patrickbruneel
Here's a (427 page) EPA report on Solders in Electronics: A Life-Cycle Assessment http://www.epa.gov/opptintr/dfe/pubs/solder/lca/lfs-lca-final.pdf If you look at page ES-16/table ES-4 and ES-5 it appears that SAC alloys have a higher impact on the
Electronics Forum | Fri Mar 24 11:12:06 EST 2006 | patrickbruneel
You�re a good man Rob and a good patriot, you defend your governments decisions even if they're wrong. Isn't the WEEE directive aimed at preventing electronics ending up in a landfill? This immediately takes away the leaching arguments and is a great
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