Electronics Forum | Wed Sep 28 20:54:04 EDT 2005 | Ken
I would run scale calibration first (for the suspect camera). That may be your only problem. However, if your having a rotation issue and all major angles are off (differently) then it is most likely R-axis accuracy. However, I would run AMF and
Electronics Forum | Thu Dec 12 17:48:21 EST 2019 | davef
You proved that the standard solderability test of components may be effective for assessing aged components. Curious Minds Can you get the authorization to use a more aggressive flux? Will that flux solve the problem? What's it going to cost to qu
Electronics Forum | Tue Dec 17 05:58:36 EST 2019 | robl
We had a customer who used XRF to determine the thickness of the "tinned" layer of components - sort of what is briefly mentioned in Bob Klenke's SMTA paper - http://www.circuitinsight.com/pdf/Solderability_Testing_Protocols_Component_Re-Tinning_Me
Electronics Forum | Wed Dec 11 06:47:33 EST 2019 | ameenullakhan
Dear Friends, Need your valuable feedback on how to identify the component is ok or not for manufacturing. Issue : We have parts which are more than 5 years old.And management want us to qualify this parts for production. We presently use below me
Electronics Forum | Fri Dec 13 12:29:01 EST 2019 | davef
I'm not conversant in the topic, but I know suppliers to the government are concerned as you are. I have attended sessions on the topic at technical conferences. The topic that you want to search for is long-term storage protocols for electronic comp
Electronics Forum | Mon Dec 16 00:08:18 EST 2019 | ameenullakhan
Hi Norah, Thanks.. Components are stored in controlled environment of 20 to 25 deg c & 40 to 60 % humidity. Baking wont be feasible for many parts. Mainly for passive parts in tape and reel. 0402, 0603 & 0805 packages. Cold baking is not feasible
Electronics Forum | Fri Dec 13 10:33:27 EST 2019 | ameenullakhan
Dear Dave, We cant change the solder paste. Its a for defense and aerospace projects. Customer won't agree on it . We have major issue in ROL0 Flux classified solder paste. cannot go for aggressive flux chemistry. So need a good method to hold th
Electronics Forum | Wed Feb 09 21:41:27 EST 2000 | Dave F
Jack: You should use your components promptly. Don't store 'em, only bad things will happen to them. 1 You should store all your components, not just your SMD reeled components, so they are not damaged or their solderability decreased. Check the
Electronics Forum | Tue Feb 20 04:18:39 EST 2001 | chinaman
Hi everyone if once the exposure time is exceeded the only option is to bake the components. I learned there is an "old spec" for the baking conditions (24h/125C or 192h/40C) and a "new spec" which is the current standard specifying conditions of 4
Electronics Forum | Wed Aug 06 16:35:31 EDT 2003 | Carol
This is an old topic, but keeps coming up. Solderability and reliability issues with SMT gold plated terminations when used with tin/lead solder paste/hassle finish PWB. I need to know which standard (mil, IPC, J-STD??) tells you all about the probl