Electronics Forum: old date code bga (Page 1 of 5)

Best practice to validate the old - more than 5 year old parts

Electronics Forum | Fri Dec 13 10:31:51 EST 2019 | ameenullakhan

Dear Alex, thanks for the machine link. And valuable feedback. We cant change the solder paste. Its a for defense and aerospace projects. Customer won't agree on it . We have major issue in ROL0 Flux classified solder paste. cannot go for aggress

Best practice to validate the old - more than 5 year old parts

Electronics Forum | Fri Dec 13 10:33:27 EST 2019 | ameenullakhan

Dear Dave, We cant change the solder paste. Its a for defense and aerospace projects. Customer won't agree on it . We have major issue in ROL0 Flux classified solder paste. cannot go for aggressive flux chemistry. So need a good method to hold th

Best practice to validate the old - more than 5 year old parts

Electronics Forum | Wed Dec 11 06:47:33 EST 2019 | ameenullakhan

Dear Friends, Need your valuable feedback on how to identify the component is ok or not for manufacturing. Issue : We have parts which are more than 5 years old.And management want us to qualify this parts for production. We presently use below me

BGA Solder Short

Electronics Forum | Tue Jul 18 00:15:37 EDT 2023 | hazira1991

Is a fresh lot. This bga is old date code 2010. we had received this BGA 2021 and the baking process is done during receiving time. Production received with vacuum seal , its very hard to tell how the BGA handling and stuff and the BGA already EOL. I

BGA Voids

Electronics Forum | Fri May 21 15:36:54 EDT 2010 | pforister

Erli, Thanks for your feedback. The BGA hybrids were baked before production. I had a particular date code that we dis-continued using. This date code was consistently voiding near or above 25%. The other date codes still produced voiding on ave

Shelf Life of Components (solderability)

Electronics Forum | Tue Feb 15 21:27:18 EST 2005 | davef

Component shelf life depends on: * Solderability protection type. * Quality of process and materials used in applying solderability protection. * Duration of time from when the solderability protection was applied. * Packaging used in component stor

Re: Component Shelf Life

Electronics Forum | Thu Aug 29 07:21:28 EDT 2002 | nifhail

What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont

component shelf life

Electronics Forum | Thu Aug 29 17:45:54 EDT 2002 | nifhail

What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont

BGA & QFP post reflow inspection

Electronics Forum | Sat May 07 12:20:56 EDT 2005 | mrmaint

If you do 100% incomming inspection the operator will not have to worry about the part being right or wrong. we do 100% at our facility and create a custom barcode label for lot code and date code traceability. that way we know if the part does not h

Silver Immersion Finish - Moisture bake out guideline?

Electronics Forum | Fri Apr 23 17:59:54 EDT 2010 | hegemon

Therein lies the issue. Unknown storage conditions before we received the PCBs, date codes just expired (2 weeks), first article is de-lam city! Had a bad feeling about it. Have read some studies showing that there is no linear tie in of visual cha

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