Electronics Forum | Tue Jul 18 00:15:37 EDT 2023 | hazira1991
Is a fresh lot. This bga is old date code 2010. we had received this BGA 2021 and the baking process is done during receiving time. Production received with vacuum seal , its very hard to tell how the BGA handling and stuff and the BGA already EOL. I
Electronics Forum | Fri May 21 15:36:54 EDT 2010 | pforister
Erli, Thanks for your feedback. The BGA hybrids were baked before production. I had a particular date code that we dis-continued using. This date code was consistently voiding near or above 25%. The other date codes still produced voiding on ave
Electronics Forum | Thu Aug 29 07:21:28 EDT 2002 | nifhail
What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont
Electronics Forum | Thu Aug 29 17:45:54 EDT 2002 | nifhail
What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont
Electronics Forum | Fri Apr 23 17:59:54 EDT 2010 | hegemon
Therein lies the issue. Unknown storage conditions before we received the PCBs, date codes just expired (2 weeks), first article is de-lam city! Had a bad feeling about it. Have read some studies showing that there is no linear tie in of visual cha
Electronics Forum | Wed Apr 08 11:33:51 EDT 2009 | 1036
2) STD FR4 material with HASL finish, 4 layer board. Reflowed under tin-lead temps with another 4 layer board same time(no delamination problem). 3) We uasualy do not pre-bake board unless board is too old. 4) We do not have the board on hand right
Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70
Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f
Electronics Forum | Wed Nov 17 11:51:24 EST 2010 | vetteboy86
We have a problem child part. Our company was in a pinch and ordered parts from a broker that had an old date code. The leads are very oxidized, and our reflow process is comprimised. To prove the concept, we cleaned the leads with Tarn X and an aci
Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan
Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have
Electronics Forum | Tue Jun 16 15:00:12 EDT 1998 | Gary Simbulan
There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior
