Electronics Forum | Fri Apr 16 17:20:34 EDT 2021 | astarotf
We are currently producing a project that brings a TQFP64. But some boards do not solder the component well with its ideal fillet, some are well soldered when they come out of the reflow oven, but some are not. Can the pins be sulphated? How can we c
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
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