Electronics Forum: omniflo and points (Page 7 of 22)

Palladium finish and solder balls

Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied

Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run

Fuji Pick and Place Machines

Electronics Forum | Sat May 08 09:59:21 EDT 2004 | fastek

What you need to remember is Fuji didn't make a name for itself by building this XP platform. They're strengths are/were in their chipshooters. Don't just assume that because it's Fuji it won't have reliabilty issues. I'm not sold on this platform ye

tape splicing pros and cons

Electronics Forum | Thu Sep 22 13:09:16 EDT 2005 | gregp

Thanks for the reply Rob, This we already do. The machine will pick from the most efficient available feeder (assuming multiples of the same part number)...so when you remove the primary it will seemlessly move to the next available. When you re-in

tape splicing pros and cons

Electronics Forum | Fri Sep 23 09:25:46 EDT 2005 | Base

Hey Greg, As you already pointed out yourself: unless you can do away with covertape pickup-spools (or can figure out a way to empty them without loosing tension on the covertape) your feeders will not be suitable for several consecutive splices. S

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Fri Nov 02 09:09:56 EDT 2012 | davef

Sure you can use it it with leaded HASL. Recognize that ... * Your Sn42/Bi58 will no linger be Sn42/Bi58 * Your leaded HASL will no longer be the same leaded HASL that walked in the door to your plant * Lead from HASL coatings can diffuse through the

PB-Free HASL and Leaded Solder

Electronics Forum | Thu May 13 20:40:25 EDT 2021 | winston_one

Yes, we can't use pure Pb PROCESS. And as I say we will not use it anyway, as we have lead-free BGA's, LGAs, component with Solder Charged Terminations... It's became almost normal practice to solder it with leaded solder pastes. In this case peak re

Re: SMD Inspection and Touch-up

Electronics Forum | Fri Jul 23 23:47:03 EDT 1999 | Scott McKee

| | | There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not perform

Desiccants and pcb finish degradation?

Electronics Forum | Tue May 15 21:57:06 EDT 2001 | davef

Welcome!!! Where the hay ya been??? Sorry bud, were lining-up with your fab [it hurts me to say that, but when yer  ] We used to dry pack with desiccants, also. Its probably an old MIL-STD-2073-1C requirement [er something like that]. We qui

BGA ball and PCB pad

Electronics Forum | Fri Feb 20 13:01:26 EST 2004 | Jay

First, it depends on the alloy composition of the solder. As you might know, eutectic Sn/Pb solder has the lowest melting point among available conventional solder systems. (except those based on Sn-In and Sn-Bi systems.) For example, 63Sn/37Pb - 183

New Pick and Place Operation

Electronics Forum | Fri Jun 04 08:25:06 EDT 2004 | Cal

OK I am game and will put some input here...I do like the Samsung machines for the price and they are easy to program. Another company you may want to look at is Essemtec. ESSEMTEC USA Glasboro, NJ 08028-1499 Steve Pollock Tel. 1/856 218 1131 Fax 1/


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