Electronics Forum | Fri May 14 09:00:35 EDT 2010 | rafacadiz
I attached a RX picture. A lot of voids and micro balls arround the flux residue. What do you think, relow temperature reflow or OSP poor weeting.? I appreciate your comments. Thanks,
Electronics Forum | Sat May 15 11:27:26 EDT 2010 | davef
We'd expect both OSP poor wetting and improper reflow recipe to show-up in more places than just this one component. But if those are the only choices, we'll go for 'wrong solder paste.' Ooops, that's not one of the choices. Ok, OK, we'll take poo
Electronics Forum | Wed Sep 18 10:06:30 EDT 2002 | Bob M
I place 15-20 mil a lot. You need to look at your pad to apature reduction. Your stencil thickness. The type of paste your using. We use 2-5 mil reduction on each side as a general rule on fine pitch. This varies depending on pad width. We also use 5
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