Electronics Forum: on chip pcb (Page 1 of 123)

Is there some general file format for chip placement on pcb

Electronics Forum | Fri Nov 07 09:34:31 EST 2003 | Rodion

Hello, I am writing a software that deals with chip placement on PCB and I would like to know if there is some standart way to describe what are the coordinates of the chips on the pcb, I know that Gerber file contains all the drill holes and tracks,

Is there some general file format for chip placement on pcb

Electronics Forum | Mon Nov 17 08:01:44 EST 2003 | stefwitt

The format is X,Y Theta of the component center for all placement machines. Gerber data can be useless, unless you have the reference from pin 1 to the component center. Some machines offer a CAD convertion tool. I don't know any machine, which can

Is there some general file format for chip placement on pcb

Electronics Forum | Thu Nov 27 02:52:33 EST 2003 | Giordano Trecca

I'm using a CIM software (http://www.aiscorp.com/products_npi_circuitcam.htm) to import gerber files and produce pick&place programs and paper/paperless documentation. It's very friendly, useful and fast, but not cheap. I don't know any other softwa

Re: ref: tombstoning on chip capacitors

Electronics Forum | Thu Apr 13 07:30:09 EDT 2000 | Christopher Lampron

I agree with Nick. You should check with the manufacturer to determine what type of plating is used on the components and see if the manufacturer has any recomendations on materials that may help. If no exotic materials are used, the culprit is most

Non-wettig on chip cap.

Electronics Forum | Mon Dec 10 04:15:01 EST 2001 | Beny

Thanks for your advise Now I don't found Non-wetting defect at TIN COATED 0603 after I had increased peak temp and Time above 183 C. At film caps, I still found Non-wetting in high rate at film chip size 2416. I using PANASONIC's part with identif

Non-wettig on chip cap.

Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny

Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta

Non-wettig on chip cap.

Electronics Forum | Fri Dec 07 11:46:28 EST 2001 | Brian W

Before changing solder pastes or jumping through too many hoops, check the melting point of the 100 Sn (pure tin) connection. According to Kester, the melting point of 100Sn solder paste is 232 degrees C. If you do not reach that temperature, you wi

Non-wettig on chip cap.

Electronics Forum | Fri Dec 07 08:32:56 EST 2001 | scottdavies

I have used Multicore MP-100 and Heraeus F380 pastes for a while, and experienced very few dry joint problems. May be worth checking if the pad size and/or spacing are to the correct specification for the components. Check the date codes on the comp

Non-wettig on chip cap.

Electronics Forum | Mon Dec 10 13:56:51 EST 2001 | slthomas

1) The additional activity of the OA flux probably took care of the oxydation. How do you plan on taking care of the presence of conductive and corrosive residues from it now, though? You're not supposed to wash those parts with water. 2) The tomb

Non-wettig on chip cap.

Electronics Forum | Fri Dec 07 10:56:24 EST 2001 | franciscoioc

HI, I exeperience this problem before and I tried diferent type of solder pastes.The one that help my process is a Kester solder R596L OA this is a water soluble paste that i am very sure is going to help you.You can get the technical data at http:/

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