Electronics Forum: ones (Page 1131 of 1374)

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef

We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats

High Mix/Low Volume Part Kitting

Electronics Forum | Tue Aug 23 20:46:41 EDT 2005 | darby

If I had my way - the person checking the incoming kit should be able to at least run, troubleshoot and preferably programme the SMT line. In fact they should be an expert.They have the paper work in front of them for that job. If the tape is cut - t

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Wed Dec 21 17:11:47 EST 2005 | Mike Dolbow www.atotalgps.com

Has any one considered the melting eutectic of the plated part verses the eutectic of the paste it self. Inter metallic solids can form when mixing metals. Thus this causes solder joint reliability. Also a lot of vendors are putting out pure tin prod

AOI Machines...........

Electronics Forum | Tue Dec 13 07:01:56 EST 2005 | clampron

Good Morning, We are currently using 4 Mirtec machines. We decided on the Mirtec after a side by side evaluation of several tabletop machines. I have to admit that Yestech was not one of them. However, after the evaluation, the Mirtec outperformed t

Tin Lead BGAs in leadfree paste

Electronics Forum | Sun Mar 12 01:58:44 EST 2006 | grantp

Hi, We have been soldering lead free BGA's onto products with lead based paste, and we have had no increase in defects at all. We have used a standard lead paste profile, so we are not altering the temps anything from what's recommended by the paste

Board House Pcb Question

Electronics Forum | Fri Mar 17 14:53:08 EST 2006 | Board House

Hi Brad, Being that I work for a board house here is my take on this issue. In the past it used to be 1 scrap per palt up to 10% of the total order. scrap is supposed to be sepperated to location and packaged sepertaly. Then it turned into No Scra

ENIG vs Flash Gold

Electronics Forum | Fri Mar 24 18:07:25 EST 2006 | Chris

Flash gold is just thin gold plating over electroless nickel or electrolytic nickel. Flash gold is electrolytic gold where the panel is connected to a plating rectifier and current causes the plating process to occur. Gold thickness is controlled b

DC-DC Converter with solder ball package

Electronics Forum | Fri May 26 21:25:52 EDT 2006 | mika

Yes we do place "big and heavy" SMT DC/DC:s on most of our board's. Please tell us what brand it is or at least what the package look like?!? For instance we place a different numbers of "heavy" DC/DC converters (40x20mm & 45x25mm) that has the pick-

Mis-alignment Headaches

Electronics Forum | Tue Jul 11 23:28:59 EDT 2006 | donb

Hi All, I have a continuing problem here with mis-alignment of parts on one of our Fuji CP-3 machines and I thought one of you esteemed engineering types may be able to give me a clue as to where the problem might lie. I have a Fuji trained enginee

TP9-2U questions

Electronics Forum | Sun Jul 30 10:34:52 EDT 2006 | Grant

Hi, It's hard to tell what exactly is wrong, as I personally never used the older software only the Linix based version of the machine we had. In fact when we got out machine, it was ex demo, and the sales guy said we really needed to get it changed


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