Electronics Forum | Mon Mar 18 20:49:46 EST 2002 | djarvis
We leave the next days quantity out overnight. Never had to do more than 4 kneads. On the inline we don't do any and the VMP 100s we only do one. Only seem to require kneading on the old clam shell printers - don't know why! That's with Indium SMQ 92
Electronics Forum | Sun Mar 24 16:53:44 EST 2002 | mikestringer
We place a similar square pin style of connector on one of our products. The connector is a 22mm high HW series from Samtek. We have a Yamaha YVL88 MK1 and YV88XS set up to handle them (Yes they are rebadged as Philips machines in some markets). No
Electronics Forum | Thu Mar 28 17:54:57 EST 2002 | slthomas
I realize that this is sort of off-topic, but do you have scads of solder beads (mid-chip solder balls, whatever you like to call them) with that stencil design? If not, would you mind sharing which paste it is that you are using? Email if you like
Electronics Forum | Thu Mar 28 10:11:00 EST 2002 | cyber_wolf
I use a .059" copper clad sheet of FR4 that I bought from one of our board houses. It has not started to delaminate yet, and it has been through our ovens several hundred times. I am not sure what the life expectancy of a thermo-couple is. I am not 1
Electronics Forum | Fri Apr 05 11:34:05 EST 2002 | mzaboogie
Hi Jax, Thanks for the input. I believe that the process at one time was to put the part in just before shipping. There was a problem where some boards shipped without the parts installed. (We do not perform ET on these)As a corrective action, the
Electronics Forum | Fri Apr 05 20:56:17 EST 2002 | cycorda
Dave, Some spray fluxers are a lot more efficient than others - some will have such little waste that most of it is carried out by the exhaust. One of the benefits of spray fluxing should be that it creates very little excess flux, therefore no n
Electronics Forum | Thu Apr 18 23:56:27 EDT 2002 | Abelardo Rodriguez
I'm trying to get a better understanding of the cooking process of pcb's. The use of nitrogen in reflow and wave ovens. Seems to have a wide margin of acceptance as a standard gas to prevent oxidation of metals in the board. Has any one heard or us
Electronics Forum | Mon May 06 00:09:00 EDT 2002 | ianchan
as a followup thought, what is your current peak reflow deg-C? and reflow timing (sec)? Au/Ni calls for reflow temperature of 217 deg-C for solder fusion that produces secondary eutectic alloy. there was one time we thought 183 deg-C was the magic
Electronics Forum | Sun May 12 23:40:03 EDT 2002 | caldon
Both are good machines. I think the variable here is : 1)The topaz has been around longer and more time to be refined. 2) Support structure- I give the nod to Assembleon for this one. They have a stronger Apps and FS devision. Are these the only two
Electronics Forum | Thu May 16 12:49:29 EDT 2002 | stefwitt
FAI appears to become fashionable in the Bay area. FAI on double side sticky tape is the first one I hear about. How does the customer test the functionality of the board, when the board is not soldered?. Components are not wasted for FAI. Wrong part
