Electronics Forum | Tue Sep 01 20:36:05 EDT 1998 | Rin Or
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Mon Aug 31 16:23:37 EDT 1998 | Bill Boles
We have an unusual problem here and I'm reaching for more input if anyone can help??? We are an OEM manufacturer of PCA's. After a history of consistent quality designs, we have one small memory SIMM that is causing major headaches for us and our PCB
Electronics Forum | Tue Aug 25 08:51:16 EDT 1998 | Justin Medernach
| | | Hi, | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | We have rule out the possibility of not printing any
Electronics Forum | Wed Aug 12 14:39:09 EDT 1998 | Mike C
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Tue Jul 21 10:36:31 EDT 1998 | Justin Medernach
| | Recently at the Nepcon show I saw Panasonic KME placing 0201's, must say | | with my olde eyes it was hard for me to even see the little buggers. Wondering if any of you are placing 0201's? what are the pros & cons, UPH, and what equipment you
Electronics Forum | Mon Aug 03 20:07:37 EDT 1998 | Dave Kalen
| | | Recently at the Nepcon show I saw Panasonic KME placing 0201's, must say | | | with my olde eyes it was hard for me to even see the little buggers. Wondering if any of you are placing 0201's? what are the pros & cons, UPH, and what equipment
Electronics Forum | Thu Jul 09 11:13:00 EDT 1998 | justin medernach
| IS IT BETTER FOR SOLDER PASTE TO SPREAD OUT AS FAR AS POSSIBLE ON BARE COPPER, OR FOR IT TO KEEP THE SHAPE OF THE PRINT? I'VE BEEN DOING SOME SOLDER PASTE EVALUATIONS, AND I'M TRYING TO EVALUATE THE RESULTS. I'M NOT SURE THAT BECAUSE A PASTE MAY
Electronics Forum | Wed Jun 03 18:22:19 EDT 1998 | Chrys
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
Electronics Forum | Wed Jun 03 21:40:38 EDT 1998 | Dave F
| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints
Electronics Forum | Wed Jun 03 14:17:12 EDT 1998 | Earl Moon
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
