Electronics Forum | Wed May 19 11:50:32 EDT 1999 | Chris Nuttall
We care currently running into problems during our plug via process: At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is cau
Electronics Forum | Wed May 19 13:13:20 EDT 1999 | Dave F
| We care currently running into problems during our plug via process: | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is
Electronics Forum | Thu May 20 07:53:55 EDT 1999 | Chris Nuttall
| | We care currently running into problems during our plug via process: | | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.Thi
Electronics Forum | Mon Jan 11 14:48:44 EST 2010 | davef
SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave us this note. We have lost their name. It seems to be good advice. If Liquid Photo Image (LPI) solder mask is required, do not tent via holes. Tenting
Electronics Forum | Wed Mar 23 22:29:21 EDT 2011 | nkinar
I have a few prototype circuit boards with BGA footprints where some (but not all) of the vias have been placed too close to the pads. During reflow, some of the solder from the balls flowed into the holes. Only one of the pads under the BGA is not
Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef
First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us
Electronics Forum | Mon Aug 18 14:38:51 EDT 2008 | floydf
Real Chunks, Does "aperture opening 100% same size as the via" mean, aperature the same size as the hole, or the barrel of the via. If that makes any sense. Thanks
Electronics Forum | Sun Feb 13 01:35:55 EST 2000 | Dean
Without further information my first guess would be lack of flux to "cut through" the ENTEK layer. Question: In X-ray is the suspect ball of equal diameter when compared to adjacent balls? If no then the volume of solder is different which would po
Electronics Forum | Tue Sep 07 12:45:47 EDT 1999 | Brad Kendall
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Are you having a problem with the joint openning up after reflow. Like it was soldered after the reflow process, but at final test is not? I had this pr
Electronics Forum | Thu Jan 06 08:03:47 EST 2005 | davef
On solder in vias: It looks like the via are not solder masked well and pick-up solder either: * Solder coating ... OR * During leveling It's possible that the design specifies openings in the solder mask for these via. On solder in the unsupporte
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