Electronics Forum: opening bake over door during drying (Page 1 of 3)

Baking parts of mixed thickness / time in oven requirements

Electronics Forum | Thu Sep 19 15:39:16 EDT 2019 | qanalyst1

When baking parts at 90C that require 15 hours bake time with parts that require 25 hours bake time, is it acceptable to open the oven and remove the former (15 hours) parts and then continue the 25 hours cycle for the remainder of the parts in the o

Moisture absorption in the solder paste

Electronics Forum | Wed Nov 09 02:24:49 EST 2005 | laxman

Hi Dave, Normally in our country (India) during rainy season the temperature will be 25to 30 �C and RH of 50 to 60%. The reason behind this humidity issue is that recently we have moved to our new facility with centralised air conditioner with Chill

baking boards, revisited

Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis

Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in

Re: Wave Soldering Moisture Sensitive Devices

Electronics Forum | Fri Jul 10 14:16:06 EDT 1998 | Bob Willis

As Steve said there should not be a problem with cracking plastic components but if you are reaching 180c there will be a problem with secondary reflow on the top side of the board. PCBs flex during wave soldering as they do during reflow if not supp

Re: Solder Resist Solder balls

Electronics Forum | Tue Dec 22 12:32:16 EST 1998 | Earl Moon

| Folk's, | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, texture,

Need Expert Support - Popcorning

Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette

Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level

BGA & QFP post reflow inspection

Electronics Forum | Wed May 04 17:15:02 EDT 2005 | siverts

Hey Dr . Klein, I think You do it all right... But here it comes: MSD; what does it really means? MS-level; what does it really means? Floor life what does it really means? I'm sorry but I can't answer all these questions right now. It is a complex m

Military Lamina bake-out

Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef

IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for

Re: Drying ICs any advice

Electronics Forum | Sun May 17 13:46:30 EDT 1998 | Steve Gregory

Hi All! I've been reading this conversation which prompted me to break out the IPC-SM-786A from the IPC manuals from our parent company in Maryland sent us (we're just starting up in California). It's the Procedures for Characterizing and Handling of

Cleaning

Electronics Forum | Tue Dec 22 12:08:06 EST 2015 | aqueous

The overwhelming technology used in post-reflow cleaning of electronic assemblies is aqueous. Prior to the 1990's, solvents and vapor degreasers dominated the cleaning industry. After the popular solvents were banned via a United Nations treaty, alte

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