Electronics Forum | Mon Feb 12 21:38:38 EST 2007 | DEK Answer Guy (PR Dept)
Technical Papers) -ProFlow� upgrades (MPU's). -Paste Low Optimisation -Adjustment of the Print Carriage to ensure Squareness to the Stencil -Replacement of Hinge Pin Assembly -Conversion of ProFlow� to Horizontal Mount -ProFlow� Guides for Operators
Electronics Forum | Mon May 23 16:42:31 EDT 2016 | pforister
Leeg, A simple cluster is pretty easy to do. Each side needs to be optimized individually first. Then, follow these steps... 1) Load Production Planning 2) Click File/New 3) Right click on line 001 under the Program name column 4) Click Reserv
Electronics Forum | Wed Mar 24 23:12:48 EDT 2021 | grahamcooper22
0.66 area aspect ratio...so for example...if the device is 0.5mm pitch QFP, the pcb pad may be 12 thou wide..make the aperture 9 to 10 thou wide...and reduce it's length by 10 % overall compared to the pcb pad.... Depending on device pitch, select ap
Electronics Forum | Mon Apr 19 08:56:22 EDT 1999 | Andreas Foehrenbach
| Hello. | | I'm now investigating the current technological issues | on surface mount devices. | For example, I want to know the limitation of | the surface mount machine. | | Where can I get the materials for this purpose? | | Thank you | Hy
Electronics Forum | Mon Oct 18 05:23:01 EDT 1999 | Brian
Steve What do you mean by better? More/less activity? fewer retouches? longer shelf life at ambient temperature? less hygroscopicity? longer open time on the stencil? easier to wash? easier to treat waste water? easier for washing machine maintenanc
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