Electronics Forum | Thu Jan 24 09:53:56 EST 2002 | davef
You didn�t tell us about your solder, wave temperature profile, or the distribution of the problem. So, let�s assume the solder is near eutectic and the problem is wide spread. Wolfgang makes good points. So, let's talk a different tact. When we
Electronics Forum | Wed Dec 08 10:25:00 EST 1999 | John Thorup
Hi Ken Given the small mass of the dot I'm guessing that the adhesive is being flash cured by the heat of the board and the resulting semi-solid is unable to release from the nozzle like a liquid thereby causing your strings. Placing components on c
Electronics Forum | Thu Aug 15 15:44:46 EDT 2002 | dragonslayr
You can't control what you don't measure. You have provided very little detail other than post reflow costs are high. What defects are attributed to problems experienced prior to reflow? Are these random or recurring defects? You will need to put ea
Electronics Forum | Sun Nov 01 23:51:44 EST 2009 | boardhouse
Hi Julie, My opinion is that the top board would not pass IPC, solder mask encroachment on pads. Second board is what we call Orange peel,this can be caused two way's. 1) the solder mask was not tack dried enough prior to imaging which caused artwo
Electronics Forum | Sun May 23 15:03:06 EDT 2004 | crios
Our printers feedswith consist of 2 LEDs next to each other designed to illuminate in green, red, and amber simultanuosly per operation. The green and red in the LED create the amber (orange) color. Although, we are experiencing a high defect rate d
Electronics Forum | Thu Aug 11 21:43:19 EDT 2005 | Ken
Those temp stickers are useless unless you can stick them into the copper barrel. They can only determine "skin" temperature which has nothing to do with what is happening in the barrels. Your solder is filling the barrel then going cold. I'll gua
Electronics Forum | Fri Jul 02 09:54:02 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
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