Electronics Forum | Thu Sep 19 21:46:01 EDT 2002 | scottefiske
In the past year I was responsible for developing and leading a Team focused on AOI, Evaluation, Justification, and with a full ROI required, supporting a HMLV manufacturing environment. If you have in these economic times the additional resources t
Electronics Forum | Thu Aug 23 21:00:10 EDT 2001 | davef
We do the same quadrent every four boards in placement inspection on a Orbotech.
Electronics Forum | Fri Aug 03 17:00:57 EDT 2001 | mparker
Start with a definition of what you expect the AOI to achieve at each station. Will your in-line machine be post print? Place (pre-reflow) or post reflow? Rather than buy one very expensive machine to put at the end of the line, maybe a couple of
Electronics Forum | Tue Oct 14 20:59:24 EDT 2025 | SMTA-70251834
Orbotech PCBA AOI was taken by Delvitech. Some years ago they still had spare parts for these machines. I have the manuals but unfortunately in printed form.
Electronics Forum | Mon May 14 09:43:37 EDT 2001 | orbotech
As the face of business changes through revolutionary factors, such as the increasing rate of outsourcing, manufacturers (especially EMS plants) will strive to fine tune their test strategies to ultimately improve and sustain product quality and to r
Electronics Forum | Mon May 07 09:47:45 EDT 2001 | orbotech
An ultimate truth in AOI is that "you can not avoid what you can not see". At the post solder stage, 2D inspection is typically not enough as it simply "can not see" everything using a single perspective, and therefore, can not detect all of the faul
Electronics Forum | Mon May 07 09:46:15 EDT 2001 | orbotech
3D imaging refers to the acquisition of images from multiple perspectives using, preferably, multiple sources of illumination, while 2D imaging refers to the acquisition of an image from one perspective. An AOI system with 3D imaging is able to acq
Electronics Forum | Thu May 10 13:10:25 EDT 2001 | orbotech
A configuration of a number of AOI tools located at different inspection stages along the SMT production line has, by its nature, the ability to provide a faster and closer response to possible process related fault occurrences. Comparing with today
Electronics Forum | Mon May 07 09:47:11 EDT 2001 | orbotech
All defect types that can not be seen from top view, meaning - any defect which is characterized by more than its top 2D appearance will be hard, if at all possible, to detect by 2D imaging system. This includes: Lifted leads / co planarity J-lead
Electronics Forum | Tue May 30 04:30:22 EDT 2006 | tanearl
For Trion 2340-Orbotech AOI is not so hard to handle this automated machine, specially for offline PCB test inspection, since it only used black and white color configuration. To improve its testing capability, try using the BRIGHT_A or BRIGHT_m func
