Electronics Forum | Tue Sep 26 08:41:27 EDT 2000 | greg
I am processing PCB's that have an n-tech osp coating and am finding huge inconsistencies in wetting. Some boards process clean with good wetting and the next has terrible wetting. The boards are stored and handled properly. Has anyone had this
Electronics Forum | Mon Sep 10 23:13:08 EDT 2007 | weehn
hi, i'm from the semicon (BGA assembly). Could you advice what is the best method / procedure to remove OSP coatings from pads of the BGA substrates. thanks Wee
Electronics Forum | Tue Sep 11 22:52:18 EDT 2007 | davef
Here are some options for removing OSP coatings from pads of the BGA substrates. * Leave the substrates in storage for 13-14 months. Shelf life of OSP coating is ~12 months, depending on the product. * Wash the substrates in your aqueous washer. Ea
Electronics Forum | Mon Jul 04 01:30:24 EDT 2011 | rickysanchez
we encounter bubbles on silicone coating after oven curing.what to do to avoid bubbles?
Electronics Forum | Mon Jul 04 14:21:14 EDT 2011 | davef
The three primary causes for bubble generation in solvent-based coatings are: * Air entrapment * Solvent flash-off * Curing the coating too quickly Tell us more about your process including: * When you first notice the bubbles * Extent of the probl
Electronics Forum | Thu Jul 07 10:07:40 EDT 2011 | duso02
Interesting stuff. I must admit that I am unfamiliar with that product but we use quite a bit of Dow and they are overall excellent silicone coatings. We do nothing but conformal coating here and bubbles are usually from curing to quickly. Without kn
Electronics Forum | Wed Jul 06 15:52:36 EDT 2011 | duso02
Ricky What silicone coating are you using? Are you using at as a coating or as a potting? In other words how thick are you applying it.
Electronics Forum | Tue Jul 05 16:14:06 EDT 2011 | blnorman
Is this an addition-cure silicone? We once had coating bubbling caused by the evolution of the solvent in the paste flux under leadless components.
Electronics Forum | Wed Jul 06 20:05:02 EDT 2011 | rickysanchez
we are using the silicone Dow Corning JCR6101UP. we use it to coat the whole die including the wires.
Electronics Forum | Mon Jul 04 20:10:05 EDT 2011 | rickysanchez
1.The bubbles appear only after the oven curing.before curing no bubbles encounterred. 2.The bubbles were very small, and can be found around the die in between the die and the epoxy. 3.Curing time is 150 degC for 4 hours.
