Electronics Forum | Sun Nov 22 19:59:26 EST 2009 | prodivegsr
Hi Davef, The bubbles occurs at the body also...there's also a washing process before the conformal coating:-the Flux residue are removed after washing. ... The curing profile is also something that we are looking into during the initial troubles
Electronics Forum | Wed Sep 21 09:07:49 EDT 2016 | johnb1712
We are looking for advice on removal of BGA components once urethane conformal coating has been applied and cured.
Electronics Forum | Mon Aug 20 09:49:57 EDT 2018 | dontfeedphils
Not entirely clear on your question. We don't coat any of our hardware (assemblies are coated prior to hardware installation), so if coating needs to be reworked after this, then hardware removal is needed.
Electronics Forum | Tue Nov 10 13:31:00 EST 2009 | chris0595
When applying the ECCOBOND E3503-1 thermal adhesive to attach a HB-LED to the slug area of a MCPCB, should the OSP coating on the slug area first be removed? I have heard that OSP coatings have poor adhesion properties so I'm wondering how to do this
Electronics Forum | Tue Dec 12 19:57:56 EST 2017 | myke03o
Hi Experts. We have an expired OSP pcb and we wanted to extend the shelp life. Is it possible to rework the PCB by removing the OSP coating, micro etching and re-applying OSP finish. Any advice if this can be done? Any solution for this OSP pcb e
Electronics Forum | Fri Jun 27 10:27:59 EDT 2003 | davef
Since you�re asking the question about proper handling of OSP board, there may still be time to talk you out of using that material. * Cleaning of mis-printed board could cause non-wetting problems. This tends to remove a fraction of OSP coating. 0.3
Electronics Forum | Thu Sep 14 20:11:19 EDT 2006 | davef
You weren't specific about the OSP that you use. We use Entek Plus CU-106A. Yes, just about everything removes Entek, especially if there's heat involved. Ethone states: * Alcohol strips 70% of the coating * Water removes 15% * Kyzen Lonox only t
Electronics Forum | Tue Apr 20 22:09:03 EDT 1999 | Earl Moon
| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following
Electronics Forum | Thu Sep 10 20:46:05 EDT 2020 | SMTA-64387687
Has anyone had experience in applying OSP coating? How difficult is the process? And, what is the equipment used?
Electronics Forum | Tue Jun 05 21:14:10 EDT 2001 | davef
You aren't going to post our stuff on your "Hey, I'm the wizard site", are you? Board fab, Pad coatings, OSP 1 OSPs: Imidazole (Via Systems) is good. Entek (Enthone) works, but requires strict thickness control in fab. 2 Enthone CU56 allows one t
.jpg)
