Electronics Forum: osp holding time (Page 1 of 45)

Gloves turned green while holding hot PCBA

Electronics Forum | Sat Apr 27 21:56:50 EDT 2002 | yngwie

Thanx for the feedback. The solder mask is PSR-4000 ( need to confirm this - not too sure ). If the board got in touch with the solder bath, for the contact time of 3 - 6 secs, this should not be the case for proper curing process right ?. thanx ag

Laying down and holding large components

Electronics Forum | Thu May 22 18:47:12 EDT 2003 | russ

I would assume we are talking about a radial leaded electrolytic cap? We use Electronic grade RTV (Dow corning 3145). It sticks good and can be removed if necessary. It is also pliable so you don't have to worry about CTE or other stresses that may

New forum will be require down time

Electronics Forum | Tue Sep 29 14:53:15 EDT 1998 | Clifford Peaslee @ SMTnet

Hello all, We at SMTnet are ready to introduct a new and improved forum. I am sure all regular users will find it substantially more useful than its predecessor. The forum will be shutdown between 3 and 4 EST. Any messages submitted during that time

PCBA Production Manufacturing Time Control

Electronics Forum | Wed Apr 20 01:57:47 EDT 2022 | sn

@ProcEng1 Yea. Mostly is ENIG surface finished PCB. Sometimes there is OSP board faces issues like part shortages and is forced to hold the production and resume the second process after a few days. So, would like to know any special control on keepi

Lead Free ...

Electronics Forum | Tue Aug 31 13:23:37 EDT 2004 | frankracine

Thanks Ken for your reply. Concerning OSP, there are a few negative points that I must considered for our application. I've read all the following points in an Entek document. Never test it. - If you have a miss print and you clean the PCB, the co

Storing OSP PCBs

Electronics Forum | Wed Jun 26 13:56:01 EDT 2019 | SMTA-John

We are considering storing OSP coated PCBs in nitrogen. Will this extend OSP life ? Is the eventual failure of OSP due to oxygen eventually reaching the copper over time ?

Reflow Profile ENIG Vs. Immersion Ag

Electronics Forum | Thu Mar 24 07:06:06 EST 2005 | davef

There's a lot of comparison tables on the web. Here's one: Properties - Summary [A Winlow Circatex] Attribute||Hasl||Immersion Silver||Immersion Tin||Electroless Pd||OSP||Eless Ni / Imm Au Shelf Life (months)||12||12||12||12||12||6 Multiple Reflows

Re: SMT adhesives

Electronics Forum | Sat Sep 25 09:00:44 EDT 1999 | John

| I am developing a DOE for evaluating SMT adhesives. I would like to evaluate 3 different vendor dispensing adhesives. I currently have the Heraeus PD955M and the Loctite 3609 and 3618 selected for evaluation. I would like to add another manuf

About testability of OSP board

Electronics Forum | Sun May 02 16:57:09 EDT 2004 | davef

You're correct. We prefer to probe solder, rather than copper, because the solder absorbs the impact of the probe better than copper and so, helps preserve the life of the probe. Beyond that, OSP has a limited "shelf life". If the OSP is not coate

If we could bake the Board with OSP finish?

Electronics Forum | Thu Aug 05 16:15:18 EDT 2004 | pjc

Are you considering baking due to moisture exposure? Not all OSPs are created equal. I would check with your PWB fabricator about dry times and effects on their OSP finish. After you get it, I'd still try just one PWB for bake-dry out and check solde

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