Electronics Forum | Wed Dec 20 15:21:06 EST 2000 | OS
How should OSP PCB be handled, when stored; and during manufactruing process on production floor?
Electronics Forum | Wed Jan 21 05:01:10 EST 2004 | sd
Does anyone have any reports on OSP pcb finish and ICT Testing? Having a problem with contact issues.
Electronics Forum | Tue Sep 26 08:41:27 EDT 2000 | greg
I am processing PCB's that have an n-tech osp coating and am finding huge inconsistencies in wetting. Some boards process clean with good wetting and the next has terrible wetting. The boards are stored and handled properly. Has anyone had this
Electronics Forum | Thu Aug 05 05:28:03 EDT 2004 | Bryan
There 's one thing I'm not sure...For the OSP board finish whether we could bake and then store this kind of PCB?or whether once we opened the vacumm package of OSP board and then we can't bake it ? Thanks Bryan
Electronics Forum | Thu Jan 17 20:33:05 EST 2002 | ianchan
Hi, Can anyone help explain the benefits/disadvantages of bareboard pcb baking, as part of the pre-heat conditioning, before the bareboard pcb use in SMT production run? The pcb board is 200mm x 240mm panelized pcb board, and has 28 smaller pcb boa
Electronics Forum | Sat Jan 19 02:29:11 EST 2002 | ianchan
Thanks for the tips... found out the ex-employee guy, had pre-bake conditioning put into the process flow, as this pcb is made of polymide material, that is reputed to have historical patterns in thermal sensitivity. To avoid "thermal damaging" the
Electronics Forum | Mon Jun 28 09:15:21 EDT 2004 | jdumont
Morning all, we have been seeing some problems with the edges of some of our BGA's curling away from the PCB after reflow. Is this possibly a moisture problem? If so what would be a good time/temp to bake them at to rectify the problem? Thanks in
Electronics Forum | Fri Jan 18 04:45:32 EST 2002 | wbu
Ianchan, baking as being part of pre-heating is obviously sensless cause the PCB will not maintain any of that heat till soldering. Common reason for prebaking PCB�s is getting the moisture out to prevent outgassing, warpage and maybe other defects.
Electronics Forum | Wed Jan 13 04:27:00 EST 2016 | crystalpcb
Hi Here is our factory production capability: Shenze Electronic PCB Specification Layer Count 1 to 35 Layers Material Brand Shengyi,KB,GRACE,ISOLA,Rogers,Taconic,ARLLON,Bergquist Base Material FR-4（TG135,TG150,TG170,TG180），Halogen Free FR-4，Ceramic
Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef
There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si
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