Electronics Forum | Mon Jan 14 16:25:35 EST 2002 | bentzen
Hi Yannick A lot of things can cause solder balls and spattering. Such as a to steep preheat profile and to much solder present. Check out more info on: http://www.smtinfocus.com/smt_failure_list.html
Electronics Forum | Thu Aug 22 05:27:42 EDT 2002 | zolasteven
Hi, With regards to reflow oven or furnace, when conducting a temperature profile how does one determine how many points(Parts) on the pcboard to be measured/connected to the temperature profile. And how to determine what parts to measure? Than
Electronics Forum | Tue Aug 27 01:11:31 EDT 2002 | zolasteven
Hi Dave, Thanks for your input. By the way where I can find on-line reference on Review IPC-7530 (Guidelines for Profiling) Generally, what is the recommended frequency for conducting temperature profile? Thanks & rgds, Steven
Electronics Forum | Sun Mar 30 20:21:44 EST 2003 | iman
we are using a "recommend supplier profile", and we have gotten back to the talking table with them over this profile specs. Thanks for the pointer, have ask them on this issue. Have also asked for their phase-transistion diagram to understand their
Electronics Forum | Thu Jun 19 23:46:39 EDT 2003 | Vic Banuelos
Hi Frank In adition I recomend you reading Chapter 12 from SMT principles and practice by Ray P. Prasad, Chapman & Hall. You'll find a good guide for profiling. Good luck
Electronics Forum | Tue Nov 14 07:38:24 EST 2006 | aj
I take it you mean that the Cap "explodes"! If so it sounds like the cap is not rated for the Temperature profile you are using. Check the temp.spec of the part. Check your reflow profile.
Electronics Forum | Mon Nov 25 00:45:35 EST 2013 | igorfo
Thank you for advice, But main concern how to detect the problems with BGA on SMT line, and how I can validate "good" or "bad" profile. PS: SPC said that process Cpk 2, temperature profile in the upper spec limit for TAL and peak temperature.
Electronics Forum | Tue Feb 24 16:40:54 EST 2015 | duchoang
Could you show us the reflow profile and 0402/0201 pictures? I have had the same situation before just because insufficient solder paste ( Specially on 0201) and maybe not enough heat reflow profile.
Electronics Forum | Thu Aug 01 05:16:15 EDT 2019 | ameenullakhan
Hi , I have attached a excel file. Hope it might help you. Excel has SMT defects. Few reflow profiling issues are captured over there. Regards, Ameen
Electronics Forum | Thu Oct 27 20:46:35 EDT 2022 | emeto
Also solder paste type, optimized printer parameters suitable for this paste, correct apertures design on the stencil, stencil thickness, proper AAR, mounting accuracy and placement profile, oven profile, board thickness and a few other.
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