Electronics Forum | Thu Nov 29 22:31:27 EST 2007 | shy
Hi Stephen, The component falling off is the component that had glue. the component witout glue is being covered by masking during wave. What is the meaning by populated the part and cure it? is it run with solder paste profile or glue profile or yo
Electronics Forum | Fri Apr 28 13:23:22 EDT 2000 | Chris McDonald
We have had nsome new products come in that require Bottom side wave soldering (SMT). I have SOIC's 1206, 0805 that are Glued then Wave soldered. I have had trouble with bridging and no-clean residue with these pcbs. I have a Econopak 2 SMT two zone
Electronics Forum | Fri Jul 14 16:35:03 EDT 2000 | Dave F
Celia: Ubet. Sorry about the ranting. (It comes with the territory.) I don�t recall any peer reviewed stuff, but I seem to remember a couple of articles on white tin in "SMT" "Circuits Assembly" Magazine (er suppin� like that), but it was probabl
Electronics Forum | Fri Jul 30 14:50:26 EDT 1999 | Kevin Hussey
| I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | This ceramic substr
Electronics Forum | Thu Sep 19 10:15:36 EDT 2013 | sara_pcb
We have a PCB to be populated using reflow soldering. The board contains lead free BGA device(11x11, 1mm pitch ) and Standard SMT devices which are not lead free. Since profile temperature is different for both devices, our contract assembly house is
Electronics Forum | Sun Apr 04 08:03:41 EDT 2004 | davef
There certainly is a problem, but it�s unclear from your description whether the source of the problem is: * Design * Soldering * Component quality * A combination Recognizing the SMT connectors see stress that other SMT component do not, you give t
Electronics Forum | Tue May 26 15:27:36 EDT 1998 | Dave F
| | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and s
Electronics Forum | Tue May 26 20:18:09 EDT 1998 | Justin Medernach
| | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and
Electronics Forum | Wed Feb 09 10:21:37 EST 2005 | bandjwet
Has anyone taken any classes in SMT assembly that can highly recommend? We are looking for a class to send an engineer where there would be hands-on time on a printer, pick and place, oven profiling etc,,,, BWET
Electronics Forum | Tue Nov 27 08:21:43 EST 2007 | shy
How many mils the gap between the terminal and pad? Your practice is for technology SMT-4? What is problem with glue cure? is it due to the reflow profile? how long the glue can be keep in room temperature with humidity 40-60?
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