Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Wed Feb 16 23:17:13 EST 2000 | Richard Moreno
Does anyone know of a SMT reflow modeling simulation that I could use as a baseline for reflow profiling? I'm looking for a quick means of setting up oven profiles for various oven sizes based upon board density (grams/sq in) and conveyor speed.
Electronics Forum | Fri Sep 22 12:37:18 EDT 2000 | jonyoder
I am having problems with SMT electrolytic capacitors expanding and changing values after going through our reflow. The reflow profile we use includes temperatures of 200 deg C for 60 seconds and 230 deg C for 30 seconds. We need to use this profil
Electronics Forum | Wed Feb 16 23:17:13 EST 2000 | Richard Moreno
Does anyone know of a SMT reflow modeling simulation that I could use as a baseline for reflow profiling? I'm looking for a quick means of setting up oven profiles for various oven sizes based upon board density (grams/sq in) and conveyor speed.
Electronics Forum | Tue Jun 08 05:02:09 EDT 1999 | Charlie Thornton
Can anyone please help me locate details on maximum allowable temperatures of components when passing through a reflow oven. I think I want the thermal profile for the part, or a source or standard which will allow me to check if I can safely reflo
Electronics Forum | Tue Jan 08 15:00:47 EST 2002 | D Macneil
I have recently purchased a datapaq 9000 and need to create an ISO document to use this device in my process. I will be using it for profiling new jobs for SMT and TH as well as monitoring the consistency of the oven performance. Before I create this
Electronics Forum | Mon Jul 29 17:03:03 EDT 2002 | burb1999
Just setting up a new SMT line and have questions on which profiling product to use. So far the two in consideration are Super M.O.L.E. Gold and Slim KIC 2000... Please share any thoughts, experiences you have had with either and your opinion....
Electronics Forum | Sun Apr 13 19:50:20 EDT 2003 | yukim
Hi, We are placing (+) & (-) terminals in SMT. We have just changed the plating of them: from Nickel to Tin (Sn). During the trial, we used the same reflow profile as before changing, and the solder seems different: a bit cold, with some solder paste
Electronics Forum | Wed Jun 18 09:43:42 EDT 2003 | blnorman
We have a line that is double sided reflow and reflow/wave depending on the product being manufactured. We asked Loctite if we could cure our chipbonders with the reflow profile to eliminate having to change oven profiles for each. They said we wou
Electronics Forum | Sun Mar 04 11:15:41 EST 2007 | Jim
>We have looked at a few, and some use the removal time to >>calculate the placement time, which seems like a good idea. The problem with this method is that you can't develop an accurate removal/installation profile. You are removing a component a
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