Electronics Forum | Thu Jun 06 15:18:56 EDT 2019 | gregoryyork
Honestly, If I ever have an SMT problem it's when a profile is at 230-235C. We encourage minimum 240C and typically 245-250C. Many components call for 260C. Some Paste manufacturers advocated 230C in the early years of Lead Free and it was a disaster
Electronics Forum | Fri Jun 26 14:27:51 EDT 2020 | victorzubashev
Hi Indhu, It could be multiple reasons but probably one root cause. metal nut might require reflow profile change- you need to check it with SMT reflow profiler. the part might be oxidized - you can check solderability or try to solder part using a
Electronics Forum | Fri Oct 18 07:56:26 EDT 2002 | cyber_wolf
I have a question to pose for all of you. We use BTU TRS ovens for all of our SMT reflow. Anyone that has had any experience with these ovens knows that they are large and the have a lot of " thermal mass" Which means to me that they are very stable
Electronics Forum | Tue Jun 10 10:58:54 EDT 2003 | Frank
Hi, I currently work on SMT department to uptimize all process. I've just selected the solder paste after testing 15 different products. To be able to do that, I had to create a procedure to evaluate each paste and to be sure that my profil was per
Electronics Forum | Wed Dec 20 23:29:32 EST 2006 | Jack
Hi all, Is there anyone know the correct way to obtain the accurate temperature profiling for oven reflow? Are below claims true? (1) Instead of full components on the PCBA (Motherboard), the profile taken from PCBA with few components can be cons
Electronics Forum | Sat Jun 17 09:09:15 EDT 2000 | Chrys Shea
Contact the adhesive manufacturer, or their website. Most adhesive suppliers offer two cure options - one with a belt oven profile and one with a box oven profile. The belt oven is usually a ramp and plateau of 120-150C for approx 2 minutes. The b
Electronics Forum | Sun Apr 21 09:34:03 EDT 2002 | hany_khoga
Dear all: We need to glue some chip capacitors (0603 & 0805) before continuing the process of placing the topside SMT components. As a subcontractor we received the whole materials including the glue. After experimenting several temperature profiles
Electronics Forum | Fri Jul 15 06:50:02 EDT 2005 | Rob
It looks like the 330 Convection & the GF120 ovens would really stuggle to do lead free, with 3 zones (the 330 has 3 top, 1 bottom). Can't comment on the 545 oven, you'll have to get them to run profiles with a selection of your boards & check on
Electronics Forum | Wed Feb 25 21:37:12 EST 2015 | dinhhuunam
Hi Bartel , 1.1 Profile Solution to Cold Soldering Cause for Cold soldering The peak temp of reflow is too low. The preheating temp is too high and it takes too long Solution Lower the preheating temp and increase the peak temp in the reflow zone
Electronics Forum | Sat Jul 24 10:20:15 EDT 1999 | Bob Willis
PCB Solder Finishes Survey Questions 1999 Results for the 1996-7 survey are located at www.smartgroup.org As a number of SMART people have requested an update on the solder finishes survey SMART Group have run in the past here is your opportunity t
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