Electronics Forum | Fri Apr 30 16:44:23 EDT 2004 | davef
You're correct. Higher resistance with an open makes more sense. Try running your profile on that J6, corner ball. There may be something in the board layout that is sucking the heat from that pad.
Electronics Forum | Tue Jul 06 19:45:03 EDT 2004 | ANDREW
Based on the attchment it looks like both are low profile and cater for high IO point.What are the challenges in running this 2 type of component?Is there any additional process required other than normal SMT for these 2 packages,like underfill ?
Electronics Forum | Wed Nov 30 21:21:57 EST 2005 | Kwon Jun Kwak
any use the ramp, soak and spike profile methode, or with lead free using the straight ramp approach? What most paste manufactures recomended?
Electronics Forum | Thu Dec 01 11:46:41 EST 2005 | pjc
FYI: Most Sn/Pb and Pb Free solderpastes today are designed to run both a ramp-soak-spike or ramp-spike profiles.
Electronics Forum | Mon Jan 09 16:47:45 EST 2006 | slthomas
Perhaps I read your question wrong, but I would be more inclined to look for changes in your solder paste, your screen printing process, and your reflow profiles if you're suddenly having problems with more than one component.
Electronics Forum | Fri Apr 07 08:08:06 EDT 2006 | choppy
When reworking a BGA, we apply paste, inspect alignement with a camera and then proceed with the temperature profile. For the majority of the other components easily side accessible we do them by hand soldering.
Electronics Forum | Fri Dec 01 11:36:53 EST 2006 | Rob
These are usually 260C for 5 seconds, however, this is only the top end of the graph. Ask your supplier for the recommended profile for this part and check that you are inside the curve for the whole process. We are going through around 250K of the
Electronics Forum | Fri Dec 01 06:41:54 EST 2006 | CHITRA K
We get both leaded components and lead free ( MIX OF COMPONENTS) components . In order to achieve good soldering results, please provide generic profile for reflow and wave soldering .
Electronics Forum | Fri Jul 20 08:16:48 EDT 2007 | hussman
Wow, I've never heard of this. If it voids during cure you either have a hot profile or bad adhesive. We use Loctite Chip Bonder. No problems.
Electronics Forum | Thu Aug 02 08:05:59 EDT 2007 | realchunks
Hi John, If you are wicking very high o components, try speeding up your conveyor speed slightly. A few inches per minute will not change your profile much and may get rid of this problem.
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