Electronics Forum | Thu Nov 30 00:41:23 EST 2017 | abhilash4788
Dear All, I have OSP finsh pcb on my production, the pcb thickness is 1.5mm and the product is one sideded pcba. After reflow process, Is there any specific time frame defined for smt completed OSP finish pcba before going for wave soldering proce
Electronics Forum | Mon Apr 26 11:04:53 EDT 1999 | Dave F
| | Earl said, in essence: | | | | | Justin is absolutely right ... | | | | | | Again, Entek is not much more than a flux coating ... | | | | | | Metallic coatings protect best, as we all know - especially those electroplated. Those coatings chemi
Electronics Forum | Wed Apr 14 09:44:34 EDT 2004 | Vince Whipple
Frank, Your initial question about temperature profiling is a critical point to a good wave solder process. Especially if you have a No Clean flux. As recommended by many in the thread above, get the Process Data Sheet for your flux (this is not the
Electronics Forum | Sat Jun 30 04:43:09 EDT 2001 | brendan
Hello We introduced OSP finish on some of our products but now need to add some discretes at the end of the process. From my little knowledge of OSP, this is difficult. We'll SMT the boards and transfer them to another site for further processing.
Electronics Forum | Thu Sep 06 22:01:21 EDT 2007 | syedsmt
Hi! I am Syed from Hitachi located in Malaysia.It seems that the discussion about OSP is very much related to the dillema that I am facing in my company.I am the Senior Executive for the SMT Department at Hitachi.Currently we are facing some issues w
Electronics Forum | Tue May 11 11:17:36 EDT 2004 | pjc
Nope, haven't heard anything. I'd check your reflow profile, contact Alpha. Also, UP78 is a very old solderpaste product. I would consider switching to one of their newer products.
Electronics Forum | Wed Dec 07 11:16:47 EST 2005 | pete_d
I'm curious to know, if using the same paste and profile,would this phenomena would occur on Copper OSP boards...any input?
Electronics Forum | Mon Feb 09 10:51:10 EST 2015 | jax
If solderability is the only concern, then there is no standard time. Multiple factors involving OSP thickness, Flux activation levels, profile parameters, storage environment will drive the problem. You just need to perform tests to determine your m
Electronics Forum | Tue Feb 13 14:33:16 EST 2007 | CK the Flip
So the moral of the story is..... these SAC305 BGA's were accidentally mixed in with a Leaded process, the profile couldn't get hot enough due to Tg and Td constraints on a known good QFP on the same board, and consequently, the whole assembly fail
Electronics Forum | Fri Jun 27 10:27:59 EDT 2003 | davef
Since you�re asking the question about proper handling of OSP board, there may still be time to talk you out of using that material. * Cleaning of mis-printed board could cause non-wetting problems. This tends to remove a fraction of OSP coating. 0.3
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