Electronics Forum | Wed Feb 23 19:04:19 EST 2000 | Jason Nipper
Hi Mike, I have had problems in the past that were very difficult to determine the source of. Our tombstoning issues were caused by the plating on the part itself. If your smd placement, x-y positioning and placement pressure is not an issue, and
Electronics Forum | Tue Aug 22 14:59:55 EDT 2000 | Mike Naddra
What does the reflow profile look like , the question I had was surrounding the higher reflow temperature and the max temperature that lowest thermal mass components will see. Some other questions that I had were surrounding the components , what of
Electronics Forum | Tue Jan 23 17:27:14 EST 2007 | russ
Well I am a CM, it has to be that OSP finsh!!! hahahaha seriously I hate that finish. but this is big BGA and there could be a multitude of issues as you suggested. Do not assume that the boards were 100% tested for all vias and lines unless yuou
Electronics Forum | Fri Oct 24 13:21:12 EDT 2008 | evtimov
Hello Bong, I would make one test only. Make one batch using the problem part from a different vendor. That will answer your main question. For me the part is causing all your problems. If it is possible, change it. Last time having problem like you
Electronics Forum | Mon May 14 14:51:36 EDT 2001 | Brian W.
Personally, I prefer the OSP. I get a flat surface to deposit paste on, resulting in more consistent solder paste volumes. With HASL, the amount of plating and the mounding affect the paste deposition. I have even had it affect the placement. The
Electronics Forum | Wed Feb 11 16:38:20 EST 2015 | barryg
I was curious what others in pcb assembly are doing as far as profiling. Is profiling an important part of the smt process? Should every board type processed be profiled to determine optimum oven temps per paste recommendations.Is it ok to assume tha
Electronics Forum | Sat Aug 14 21:31:31 EDT 2004 | Daveylau
I'm currently working in a SMT factory in China. I'd like to know what preparation that I would need to change from leaded to lead free soldering. 1.Starting with the PCB production, things that I need to concern about are solder mask, Cu protection
Electronics Forum | Tue May 26 14:50:07 EDT 1998 | Dave F
| | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and sol
Electronics Forum | Sat Jun 30 11:28:24 EDT 2001 | davef
Consider using a roll solder with a flux that well matches the residues you can accept to be remaining on the board when you get finished processing. Many people use a no-clean flux cored roll solder for such operations, because they don't want to c
Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef
A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition
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