Electronics Forum | Sat Sep 08 08:55:24 EDT 2007 | davef
We expect to see a copper shadow along the edge of pads when soldering boards with organic solderability protection [OSP]. IPC-A-610 has defined this as acceptable for years. During early reflow stages, the flux in paste dissolves the OSP where ther
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef
Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr
Electronics Forum | Wed Apr 02 15:55:04 EDT 2008 | boardhouse
See if you can find someone with an XRF machine or talk to your Current Board house they probably have this equiptment if they run ENIG or Silver finishes. I would stop in with some boards your having issues with and have them measure the thickness.
Electronics Forum | Wed Oct 10 16:16:15 EDT 2001 | lisa
Hello all, I'm looking for some advice on inter-metallic formation. I have some circuit board finished with Immersion Tin, Immersion Silver and OSP. They have been reflowed with solder past and components,the joints look good. What can I expect fo
Electronics Forum | Wed Jan 11 22:47:31 EST 2006 | davef
We didn't intend to light anyone's fur on fire [get anyone's underwear in a knot, roil the waters, have a cow man] about consultants. The Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
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