Electronics Forum | Thu Jul 06 23:59:11 EDT 2017 | heros_electronics
We got an inquiry from US that requires high volume 8 layer 1.0mm PCB, OSP + selective ENIG surface, 5 groups impedance control, and stacked vias. These requirements are common, but there is 2/2mil lines in inner layers. It's said that this order was
Electronics Forum | Mon Jul 24 20:39:49 EDT 2017 | dawson
We got an inquiry from US that requires high > volume 8 layer 1.0mm PCB, OSP + selective ENIG > surface, 5 groups impedance control, and stacked > vias. These requirements are common, but there is > 2/2mil lines in inner layers. It's said that th
Electronics Forum | Sat Mar 15 09:30:29 EDT 2008 | davef
Unlike other solderability protection, immersion coatings [eg, ImAg, ImSn, OSP, etc] can be reworked by the board fabricator prior to assembly operations. Reasons for selecting immersion are: * Until a supplier can demonstrate that they can turn bla
Electronics Forum | Thu May 09 17:13:10 EDT 2002 | davef
We are converting all our ENIG to imm silver. CHARACTERISTICS * Nominal thickness of the deposit will be 0.1 to 0.3 microns. * Deposit is flat and uniform * It will withstand multiple heat cycles in assembly, which can be problematic with tradition
Electronics Forum | Fri Jan 11 17:14:13 EST 2002 | davef
We have one product with electroless nickel, immersion silver solderability protection. We do not purport to be experts, but like many things, have seemingly boundless opinions. Side note: There are a least three different [maybe five] imm silver
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