Electronics Forum | Fri Jan 08 21:46:49 EST 1999 | Dean
| | This is a question for those of you who actually assemble components onto a board. | | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall
Electronics Forum | Tue Dec 29 22:31:06 EST 1998 | Kelvin Chow
It is still a big concern on using No-clean or aqueous cleaning for CSP assembly. I prefer to use no-clean, however, not all components are suitable to use it. Especially those dirty capacitors or connectors which may cause solderability problem. It
Electronics Forum | Wed Dec 30 17:34:23 EST 1998 | Michael Allen
I'm afraid we don't agree regarding the best test method to use here. My understanding is as follows. The omegameter test measures board-level, ionic contamination (i.e., average for the entire board area and all components); it does not tell you w
Electronics Forum | Thu Aug 21 14:23:56 EDT 2003 | kenBliss
In order to service your wave solder machine safely, the following needs to be understood. Ladling dross out of the machine and putting it in into a coffee can or similar is not safe and puts operators and other employees at risk. Protecting the se
Electronics Forum | Wed Nov 05 19:40:25 EST 2003 | Mike Konrad
Here's the official press release... New York, NY (November 5, 2003) -- KPS Special Situations Fund II announced today that it has acquired the stock and related assets of Speedline Technologies, Inc. from Cookson Group, plc for a total consideratio
Electronics Forum | Mon Apr 19 13:05:31 EDT 1999 | Bob
Steve, Like you, I am sick, sick, sick of marketing. I can't go on the Internet, to a ball game or my local 7-11 without being bombarded with marketing. 7-11? Would you belive I went there to buy a Sunday paper yesterday and now they have a 27" mo
Electronics Forum | Wed Mar 10 17:03:52 EST 1999 | Morziana Hasan
NASA CommQuest Photopolymerized Conducting Polymers Directions: 1.Please read the information provided on this technology. You may follow the links to additional information resources below. 2.After evaluating the technology, please answer the
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Mon Jan 11 18:07:55 EST 1999 | Lech Bartnik
| | | This is a question for those of you who actually assemble components onto a board. | | | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your ove
Electronics Forum | Thu Dec 31 01:09:18 EST 1998 | Kelvin Chow
Dear Micheal, SIR test is used to characterize fluxes by determining the degration of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. (IPC TM-650 #2.6.3.3 http://www.ipc.org/html/tm2.6.h
