Electronics Forum: others low temperature cooling spear (Page 1 of 3)

Re: Best reflow temperature

Electronics Forum | Thu Sep 16 12:06:29 EDT 1999 | Scott S. Snider

| | | Hi, | | | | | | Can someone pls suggest to me the best reflow temperature setting | | | for a force air convection oven. The details is as follow. | | | 1) Heller 1700s | | | 2) 12 zone---6 top and 6 bot | | | 3) Solder paste --- Qualitek 691

Reflow Profiling - Cooling Rate?

Electronics Forum | Mon Feb 10 10:41:29 EST 2020 | SMTA-Tony

Hello Phil, As the other respondents have mentioned, the cooling rate is not easily controlled and varies based on the oven and board design, as well as the settings of the last few zones and cooling zones. In general, the board is going to cool in

How can the problems of the non-working ice maker be solved?

Electronics Forum | Tue Mar 19 07:24:17 EDT 2024 | aglucky

Common Reasons and Solutions for a Non-Functioning Ice Maker As one of the most frequently used and common household appliances. Our ice maker can provide refreshing food, drinks, and fast and stable service. However, in our daily lives, ice makers m

Air Moisture in Production

Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef

3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire

10 Methods for PCB Heat Dissipation

Electronics Forum | Mon Oct 26 02:00:36 EDT 2020 | chucherry5076

https://www.jrpanel.com/R The heat generated by electronic equipment causes the internal temperature to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up and the components will overheat and fail, resulting

Sn/Pb diffusion

Electronics Forum | Mon May 20 21:29:52 EDT 2002 | davef

Q1: Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? A1: Yes, but in a broader context I am saying that when someone solders correctly, they form an IMC. Q2: Will the tin diffuse with the Cu over

Lead free BGA's & std SnPb paste

Electronics Forum | Thu Oct 30 21:55:27 EST 2003 | johnwnz

Now I've checked the archives on this and found the starts of an answer but not much else, but then that posting was a while ago and I though there would be some more data now. So here's the question: who, if anyone is placeign Pb-free BGA's (ideally

Universal 4796HSP D2332 Unit drivers

Electronics Forum | Wed Sep 10 09:56:18 EDT 2003 | vickt

5 years ago (mostly likely 7-8 yrs). Most of these failures can be attributed to simple overtemp conditions or mechanical stress. Customers who do not keep the cooling fan filters clean on their machines tend to see a higher failure rate due to highe

Re: Hot Air Nife

Electronics Forum | Thu Apr 29 12:20:23 EDT 1999 | Tony A

| | Anyone using hot air nife for wave soldering process. | | Does it work? | | Does it really eliminate solder bridging and does it create any other problems? | | | | any feed back will be much appriciated. | | | | Thanks | | | | Tony A | | |

Re: Cure/Reflow Profile

Electronics Forum | Wed Feb 23 00:16:23 EST 2000 | Finepitch Services

Sal, Jax has a good point about utilizing your multi-profile oven and switching to a different profile. However, since some ovens cause trouble while cooling off and stabilizing, I will assume you do have to use the same profile for whatever reason.

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