Electronics Forum: out (Page 174 of 1201)

Re: In-circuit testing

Electronics Forum | Mon Dec 08 15:06:33 EST 1997 | Richard

| Can anyone recommend some "in-circuit test" | manufacture's? The one's I am familiar with are GenRad and HP. There are plenty out there. If you want more information on getting to them, just let me know and I will see what I can do to help. Richa

how can i id smt components that are marked with codes ?

Electronics Forum | Mon Dec 08 11:52:30 EST 1997 | j martin

part of my job function is to id all component requirements for our company. quite often i run into smt components that have mfr codes and not actual component part numbers. does anyone out there know of a way to id these parts.

Re: smt component id

Electronics Forum | Tue Jan 13 10:53:05 EST 1998 | Tonya Warner

It is also my job to ID and cross components. I have found that the same number can be used by different manufacturers for different parts, same package style. There is not a standard marking system for SMT devices so watch out for this.

Design dilemma

Electronics Forum | Wed Aug 15 20:41:50 EDT 2001 | davef

It would be nice if someone had the answer, but often situations like this are peculiar. What not build models of each and then wring them out?

Why is NC the prefer process for BGA mounting? why not WS?

Electronics Forum | Tue Aug 21 04:49:02 EDT 2001 | wbu

Mugen, are you sure you get all of the WS residues out from underneath the BGA with your equipment ? I think testing that will be quite difficult. Wolfgang

Why is NC the prefer process for BGA mounting? why not WS?

Electronics Forum | Thu Aug 23 01:23:03 EDT 2001 | mugen

Thanks, for pointing out my lack of, precision inquiry methodology.... I'll keep it in mind, and stay on my toes, next time I post a forum question... Regards

BGA placement accuracy

Electronics Forum | Wed Aug 22 09:17:15 EDT 2001 | steven

if do not have x-ray inspection machine, how to verify the 1st board out from the smt placer that the BGA is placed accurately onto the solder pads. the diameter of the solder ball is 1mm. could it self align during reflow?

Applying past with CamAlot

Electronics Forum | Wed Aug 22 14:24:39 EDT 2001 | markhoch

I used a CamAlot 5000 to apply conductive epoxy on an aluminum substrate about 4 years ago. I used the largest diameter nozzle CamAlot had, and I bumped the dispense and dwell times way up. It was the slowest stage in the process, but it worked out o

Packing material, the right track ?

Electronics Forum | Thu Jul 25 01:06:43 EDT 2002 | Steven Evers

Long term storage requires the right combination of properties. ESD anti-corrosion, archival, etc. We specialize in end-of-life storage and long term preservation of electronics and micro-electronics. Feel free to contact me and check out our new web

Solder Joint Strength

Electronics Forum | Tue Aug 28 16:41:42 EDT 2001 | davef

Very few concern themselves about the strength of solder connections, because it doesn�t require much strength to keep a solder connection attached to the board. More important are factors that arise as a result of the different materials properties


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