Electronics Forum | Tue Feb 28 07:31:40 EST 2012 | bk
I'm assuming it's your x wagon tranducers that are out of synch. So the first place to start is look at your couplings on both x motors and make sure one of them isn't broken or starting to break. After that i would try swapping out your x board with
Electronics Forum | Sat Oct 16 23:54:43 EDT 1999 | Stu Leech
We have just completed some scientific work on the subject of component bake-out and alternative methods of getting the job done quickly. If you would like a copy, email me at sleech@ix.netcom.com Stu Leech
Electronics Forum | Thu Jul 20 02:49:13 EDT 2006 | reypal
Is there any industry standard to what acceptable (%) level the throw-out component during placement.regardless, program-vison, feeder, nozzle,component problem? Thanks in advance!
Electronics Forum | Wed Aug 08 17:26:40 EDT 2007 | htran
Hello All, I have been searching for the board assemblies bake out requirements acceptance criteria but unsuccessful. Does anyone knows if there are general guidelines for the percentage of the moisture absorption in the PWBs and PWAs? Thanks, Tran
Electronics Forum | Tue Feb 28 08:19:03 EST 2012 | cyber_wolf
Replace both of the big X-wagon ribbon cables to start with. You always have to rule those out before looking at anything else.
Electronics Forum | Wed Sep 23 04:15:44 EDT 2020 | pkmkabigon
Hi all, I have a concern about how to prevent the component from bouncing out of the carrier (embossed pocket). I don't know what the reasons for this problem. Can anyone help me explain and show me the solutions to fix. Tks
Electronics Forum | Tue Dec 08 15:02:20 EST 2020 | btmzzulp
One of category throw out part in NXT fuji is Dislodge, it is not so clear, what is root cause of this dislodge and how it happened, thank you
Electronics Forum | Fri Nov 05 14:47:35 EST 1999 | Russ Cutler
We recently came to a cross roads... We have historically baked out ALL of our circuit cards, with a 2 fold purpose 1) to dry the part marking ink, and 2) to eliminate any moisture, which could result in measling further in the process of assembly.
Electronics Forum | Fri Aug 10 16:22:35 EDT 2007 | htran
Davef, The J Standard-001-DS(Ref. 4.9.3)does required board assembly bake out and the purpose of the bake out is to demoisturize the PWB and to prevent board delamination during reflow like you have mentioned earlier. Thanks for your inputs. I hav
Electronics Forum | Mon Feb 22 13:15:43 EST 1999 | Dave F
| Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. | I have come accross dry nitrogen storage cham
