Electronics Forum | Mon Jun 14 08:14:01 EDT 2004 | Arvind
For each job we create a standard BOM spreadsheet. Our problem is that for every RFQ we have to get price and availability check for each part even though many parts are used in other BOM and this information exist in other spreadsheets. I was wonder
Electronics Forum | Wed Jun 30 16:44:27 EDT 2004 | Richard
You could also try using a wire mesh out of stainless steel(won't rust). We used these as reflow baskets and for covering parts for a steam cleaner we had for W/S flux. go to http://www.mcmaster.com and type in *Metal and Thermoplastic Cloth and Perf
Electronics Forum | Wed Jun 23 13:03:01 EDT 2004 | russ
I would ditto CAL, we have a jewel box 90 with the 5 axis and we love it. I really like being able to tilt,rotate,and move side to side front to back, Angle viewing under a BGA can be very informative as to the quality of reflow in seeing ball coll
Electronics Forum | Wed Jun 30 10:24:27 EDT 2004 | K
We find keeping the work environment at about 22degC and humidity to about 40-50% is the best way to control the solder balls. Before we took measures we were out of control with solder balls especially in the summer months. We run aqueous solder thr
Electronics Forum | Tue Sep 14 04:28:36 EDT 2004 | Rob
Hi Dave, 3M� Spray 75 Repositionable 500 ml was the last we used due to a bright spark in purchasing, but production didn't get on with it too well. The only one that really gives us good consistant performance was the original 400ml Spraymount a
Electronics Forum | Mon Jun 28 10:02:06 EDT 2004 | fmonette
The answer is yes, it is possibly a moisture-related problem. You can confirm this by baking your parts at 125C for 48 hours (ref. J-STD-033A, table 4-1). For more technical background on this issue I recommend you read the following paper : Impac
Electronics Forum | Mon Jun 28 14:30:46 EDT 2004 | davef
There multiple potental causes of BGA curling during reflow. One of them is moisture inclusion in the part, as Francois mentiones above in this thread. Another has to do with the construction of a BGA. So, from our perspective, more often the mois
Electronics Forum | Fri Jul 09 11:39:44 EDT 2004 | rtaft
Hi Chris, We use RMA but are considering changing to OA if it will help us acheive our goals of high quality and low cost. Our boards are requred to meet IPC class 3. Again, I am new to this so any advice about flux is appreciated. We are current
Electronics Forum | Thu Jul 15 22:03:07 EDT 2004 | KEN
In no particular order: Will the failed joints wet when touched with an iron + flux? Is there flux surrounding the joint (post reflow). If no, you may be baking it out premateurely. Is this assembly wave soldered? Where is defect discovered in yo
Electronics Forum | Mon Jul 19 19:39:06 EDT 2004 | KEN
I once had a forced convection oven (insert brand here)...and the top 220VAC heater (reflow zone) had shorted to the frame ground, blowing the branch line fuses. THe machine had no idea the heater was out because the lower heater was heating the upp
