Electronics Forum: out (Page 638 of 1202)

Solid Solder Deposit

Electronics Forum | Fri Aug 06 11:36:15 EDT 2004 | russ

I see how that works in your shop, I was thinking of when you have someone else do it for you and then both sides would have to be done at the same time and then double reflow isn't very viable with out glue. How do you flatten the solder after refl

BGA open joint

Electronics Forum | Thu Aug 05 21:47:35 EDT 2004 | KEN

Agreed. Joint failure can happen when un-bagging or durig box-build (at customer site). Careful handling should be used. In one case I had boards returned to me for evaluation and failure analysis. Too bad our site never built the boards!!! (jacka

Wiper Paper selection (help)

Electronics Forum | Fri Aug 06 17:28:06 EDT 2004 | Steve

My suggestion is that there are alot of suppliers for this type product. Call a couple of distributors and have them send you samples. Make sure you know each manufacturer so that they don't duplicate. Review the performance and price of each one and

Efficiency Rate...

Electronics Forum | Fri Aug 13 12:49:15 EDT 2004 | WALSTIB

Russ is correct, The efficiency number, or machine operating ratio, is more relevant in a HVLM environment than a HMLV senario. I have found that in HVLM, a desirable number would be cetianly 80% plus. Low 90 is not unrealistic. One must consider

Wave solder: Vitronics-Soltec vs. Electrovert

Electronics Forum | Fri Aug 20 09:06:14 EDT 2004 | russ

I have never used the Vitronics but have pretty extensive experience with the Electra as well as Ultra-Pak and econ-pak from electrovert. I ahve been impressed with these machines for their durability and ease of use. A laminar flow with the rotary

Straddle Mount SMT connectors SCA-2

Electronics Forum | Wed Aug 18 10:34:35 EDT 2004 | russ

We do this every day, We print the bottom side, then the top, and have a tool that presses the connector on. We then process the board down the line. The only tricky thing is keeping fingers out of paste. Fortunately this is a single sided board.

Bump printing with solder paste

Electronics Forum | Thu Aug 19 15:49:05 EDT 2004 | pjc

Hi Erhard, Go to http://www.globalstencil.com They are the stencil firm that worked with MPM for developing technology for printing with thick stencils that are milled out on the bottom to account for existing components on the top side of a PC boa

History of Mass Soldering

Electronics Forum | Mon Aug 30 22:48:36 EDT 2004 | davef

Chapter 1 of Handbook of Machine Soldering: SMT and TH [Woodgate, RW; John Wiley & Sons, Inc.; 3e; 1996; ISBN 0-471-13904-1] is titled "A Brief Histroy of Machine Soldering". While a tantilizing title from the perspective of your project, it simply

PCBA IC Component rework

Electronics Forum | Fri Sep 24 13:38:16 EDT 2004 | Nick Prince

The re-use of any component has commercial implications as weel. If you check the data sheet for the component in question you will find the reflow profile, usually there will be a "Max No of Reflows". I have never seen this number higher than 2. If

Upgrading PPU computer for AI equipment

Electronics Forum | Thu Sep 02 17:39:21 EDT 2004 | rcanten

I am looking for some help in upgrading my pc that I run PPU software on for my Universal AI equipment. I have installed PPU on a 840mhz pc and everything works fine except I can not transfer programs from the pc to the uicp. The error I get is buffe


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