Electronics Forum | Thu Apr 14 14:00:44 EDT 2022 | winston_one
Also at few boards we see excessive voiding, extremily excessive. During solderind some bubbling can be observed near the soldering point. Boards was dried before assembly. May be we have a problem with too thin metallisation - that's why poor adhesi
Electronics Forum | Thu Feb 01 08:47:07 EST 2007 | davef
NASA is concerned about outgassing in high-vacuum environments. They select materials to minimize outgassing. http://outgassing.nasa.gov/og_desc.html
Electronics Forum | Tue Apr 03 13:28:11 EDT 2012 | davef
Is this related to this specific machine or this product? * Is this machine having a tough time regulating pot temperature? * Is this product dragging-out solder from the pot when it is being run so quickly? * Is this board out-gassing to create thes
Electronics Forum | Fri Jun 29 07:45:05 EDT 2012 | tommyg_fla
It sounds like the flux is not holding up during the soldering operations. That would account for the webbing, etc. Also is the problem specific to a certain board type or lot code of boards? Do you think that your boards are outgassing during solder
Electronics Forum | Tue Mar 07 21:28:30 EST 2023 | stephendo
What purity? To get 99.999% pure you will need dewers of liquid nitrogen or a two stage system. (and a dewer will last about a month and a half even if you don't use it as it outgasses.) But you can get reasonable purity with a wall mounted single s
Electronics Forum | Wed Nov 05 18:39:06 EST 2008 | joeherz
Hello, We have recently installed a selective soldering machine and are seeing some voiding/cratering in random locations. We have done some basic experimenting with fluxing parameters, preheat and dwell times but haven't been able to eliminate it.
Electronics Forum | Tue Apr 07 14:37:14 EDT 1998 | Chrys
Be careful about the material you choose. All the materials out there are basically glass-filled epoxy composites, but they are different blends with different fillers. Some of them have carbon in the matrix to make them ESD safe, but it also short
Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
Electronics Forum | Sat Mar 29 08:38:28 EST 2003 | davef
Iman When you talk about your profile, can we assume you're measuring it on the pads of LGA? Profile the solder paste reflow by placing a thermal couple under the component pad, similar to a BGA. On a slight tangent, as with soldering BGA, paste
Electronics Forum | Wed Mar 22 14:46:54 EDT 2017 | solderingpro
Laser Soldering by nature is a very dialed in process. - Requiring specially formulated flux and solder paste applications that will perform while absorbing a massive amount of energy. What I believe "Gary" is attempting to say is: Laser Soldering c
